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MAX312FESE+

MAX312FESE+

Manufacturer No:

MAX312FESE+

Description:

IC SWITCH SPST-NCX4 10OHM 16SOIC

Datasheet:

Datasheet

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MAX312FESE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -104dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    1nA
  • Channel Capacitance (CS(off), CD(off))
    20pF, 20pF
  • Charge Injection
    70pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    225ns, 185ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    9V ~ 36V
  • Channel-to-Channel Matching (ΔRon)
    50mOhm
  • On-State Resistance (Max)
    10Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NC
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XCZU2EG-1SFVC784E is a specific model of the Xilinx Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) family. This integrated circuit chip offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the XCZU2EG-1SFVC784E are:Advantages: 1. High Performance: The XCZU2EG-1SFVC784E chip combines a powerful Arm Cortex-A53 quad-core processor with a programmable logic fabric, providing high-performance processing capabilities. 2. Programmable Logic: The chip includes programmable logic resources, allowing users to implement custom hardware accelerators, interfaces, and other specialized functions. 3. Heterogeneous Processing: The combination of the Arm processor and programmable logic enables the chip to handle both software and hardware tasks, making it suitable for applications that require a mix of processing approaches. 4. Low Power Consumption: The XCZU2EG-1SFVC784E chip is designed to optimize power consumption, making it suitable for power-constrained applications. 5. High-Speed Interfaces: The chip supports various high-speed interfaces such as PCIe, USB, Ethernet, and DDR4 memory, enabling connectivity with external devices and systems.Application Scenarios: 1. Embedded Systems: The XCZU2EG-1SFVC784E chip is commonly used in embedded systems that require high-performance processing, real-time control, and custom hardware acceleration. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. Edge Computing: With its heterogeneous processing capabilities, the chip is suitable for edge computing applications where real-time processing and low latency are crucial. It can be used in edge devices for tasks like video analytics, machine learning, and sensor data processing. 3. Communications and Networking: The XCZU2EG-1SFVC784E chip's high-speed interfaces make it suitable for communication and networking applications. It can be used in routers, switches, and network appliances that require high-performance packet processing and protocol handling. 4. Aerospace and Defense: The chip's combination of processing power and programmable logic makes it suitable for aerospace and defense applications. It can be used in radar systems, avionics, and military communication systems. 5. Medical Imaging: The XCZU2EG-1SFVC784E chip's high-performance processing capabilities and programmable logic make it suitable for medical imaging applications. It can be used in ultrasound machines, CT scanners, and other medical imaging devices.These are just a few examples of the advantages and application scenarios of the XCZU2EG-1SFVC784E chip. Its versatility and flexibility make it suitable for a wide range of applications that require high-performance processing and programmable logic capabilities.
MAX312FESE+ Relevant information