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DG509AEWE+

DG509AEWE+

Manufacturer No:

DG509AEWE+

Description:

IC SWITCH SP4T X 2 450OHM 16SOIC

Datasheet:

Datasheet

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DG509AEWE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    1nA
  • Channel Capacitance (CS(off), CD(off))
    5pF, 12pF
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    1.5µs, 1µs
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 18V
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    27Ohm
  • On-State Resistance (Max)
    450Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    4:1
  • Switch Circuit
    SP4T
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S090T-1FGG676 integrated circuit chips offer several advantages and find application in various scenarios. Some of these advantages and application scenarios are as follows:Advantages:1. High Performance: The M2S090T-1FGG676 chips are designed for high-performance applications, offering fast processing and execution of complex algorithms.2. Low Power Consumption: These chips are power-efficient, consuming minimal power without compromising on performance. This makes them ideal for battery-powered devices or applications where energy efficiency is crucial.3. Enhanced Security: The M2S090T-1FGG676 chips feature advanced security features such as secure boot and cryptographic acceleration that help protect sensitive data and ensure system integrity.4. High Flexibility: These chips provide flexibility with a programmable fabric, allowing designers to customize and reconfigure the logic, memory, and I/O resources according to their specific requirements.5. Large Capacity: The M2S090T-1FGG676 chips offer a large capacity of programmable logic, enabling the implementation of complex designs or system integration on a single chip.Application Scenarios:1. Industrial Automation: The high-performance and low power consumption of M2S090T-1FGG676 chips make them suitable for industrial automation applications, such as robotics, machine vision, and control systems.2. Internet of Things (IoT): These chips can be utilized in IoT devices and edge computing applications to process data locally, reducing latency and enhancing system responsiveness.3. Automotive: The M2S090T-1FGG676 chips find application in automotive systems for tasks such as advanced driver-assistance systems (ADAS), vehicle networking, and infotainment systems.4. Aerospace and Defense: The large capacity, high performance, and security features of these chips make them suitable for aerospace and defense applications like avionics systems, secure communication, and radar processing.5. Medical Devices: The programmability and flexibility of M2S090T-1FGG676 chips enable their use in medical devices like patient monitoring systems, medical imaging, and laboratory equipment.6. Communications: These chips can be employed in communication infrastructure such as routers, switches, and network equipment, where high-performance processing and low power consumption are crucial.It's important to note that the specific advantages and application scenarios may vary depending on the specific requirements and implementation choices.
DG509AEWE+ Relevant information