MUX506IPW

MUX506IPW

Manufacturer No:

MUX506IPW

Manufacturer:

Texas Instruments

Description:

IC MUX 16:1 200OHM 28TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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MUX506IPW Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-TSSOP
  • Package / Case
    28-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -100dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    1nA
  • Channel Capacitance (CS(off), CD(off))
    3pF, 12.2pF
  • Charge Injection
    0.31pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    136ns, 78ns
  • Voltage - Supply, Dual (V±)
    ±5V ~ 18V
  • Voltage - Supply, Single (V+)
    10V ~ 36V
  • Channel-to-Channel Matching (ΔRon)
    6Ohm
  • On-State Resistance (Max)
    200Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    16:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The XCZU3EG-2UBVA530E is part of the Xilinx Zynq UltraScale+ MPSoC family, which combines a high-performance application processor with programmable logic to provide significant advantages in various applications. Here are some advantages and application scenarios of the XCZU3EG-2UBVA530E integrated circuit chips:Advantages: 1. High-performance processing: The XCZU3EG-2UBVA530E integrates a quad-core Arm Cortex-A53 processor, making it capable of handling complex application processing tasks efficiently. 2. Programmable logic: It includes programmable logic resources that can be customized to meet specific application requirements. This flexibility allows for hardware acceleration, custom interfaces, and real-time processing. 3. Multi-core processing: With a total of seven processing cores (4x Arm Cortex-A53 and 2x Arm Cortex-R5 real-time processors), it can execute multiple tasks simultaneously, enhancing the overall performance. 4. High-speed interfaces: The chip provides various high-speed interfaces, such as PCIe, Gigabit Ethernet, USB, and DisplayPort, enabling seamless integration with external devices and communication protocols. 5. On-chip memory: It features a large capacity of on-chip memory, including SRAM, DDR4, and UltraRAM, allowing for efficient data storage and retrieval.Application scenarios: 1. Embedded systems: The XCZU3EG-2UBVA530E is suitable for embedded systems requiring high-performance processing, such as industrial automation, robotics, and automotive applications. 2. Edge computing: With its combination of application processing and programmable logic, it can be deployed in edge computing scenarios, enabling real-time analytics, AI inference, and data preprocessing. 3. Software-defined networking: Its programmable logic can be utilized to implement custom network functions, virtualization, and overlays, making it suitable for networking equipment like switches and routers. 4. Video processing and image recognition: The chip's powerful processing capabilities make it ideal for video processing, including encoding, decoding, and analytics. It can also be used for image recognition tasks in applications like surveillance systems or medical imaging. 5. Aerospace and defense: With its high-performance processing and ability to handle custom interfaces, the XCZU3EG-2UBVA530E can be used in aerospace and defense applications, such as avionics systems, radar processing, or communication systems.Note: It's important to consult the datasheet and specifications of the specific chip for a more comprehensive understanding of its features and suitability for a particular application.