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MAX4559CEE+

MAX4559CEE+

Manufacturer No:

MAX4559CEE+

Description:

IC SWITCH SP4T X 2 160OHM 16QSOP

Datasheet:

Datasheet

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MAX4559CEE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-QSOP
  • Package / Case
    16-SSOP (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -93dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    1nA
  • Channel Capacitance (CS(off), CD(off))
    2.5pF, 6pF
  • Charge Injection
    2.4pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    150ns, 120ns
  • Voltage - Supply, Dual (V±)
    ±2V ~ 6V
  • Voltage - Supply, Single (V+)
    2V ~ 12V
  • Channel-to-Channel Matching (ΔRon)
    2Ohm
  • On-State Resistance (Max)
    160Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    4:1
  • Switch Circuit
    SP4T
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XCZU15EG-2FFVC900E is a specific model of integrated circuit chip from Xilinx. It belongs to the Xilinx Zynq UltraScale+ MPSoC family and offers several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: The XCZU15EG-2FFVC900E chip provides high-performance processing capabilities with its quad-core ARM Cortex-A53 processor and dual-core ARM Cortex-R5 real-time processor. It also includes programmable logic resources, making it suitable for a wide range of applications. 2. Programmability: The chip is highly programmable, allowing users to customize and optimize its functionality according to their specific requirements. This flexibility makes it suitable for various applications. 3. Integration: The XCZU15EG-2FFVC900E chip integrates multiple components, including processors, programmable logic, memory interfaces, and various peripherals. This integration reduces the need for external components, simplifying the overall system design. 4. Power Efficiency: The chip is designed to be power-efficient, enabling longer battery life in portable devices and reducing power consumption in other applications. 5. Scalability: The XCZU15EG-2FFVC900E chip offers scalability, allowing users to scale their designs and add additional functionality as needed.Application Scenarios: 1. Embedded Systems: The XCZU15EG-2FFVC900E chip is commonly used in embedded systems, where it combines processing power, programmable logic, and various peripherals to enable complex and customized functionality. 2. Industrial Automation: The chip's high-performance processing capabilities and programmable logic make it suitable for industrial automation applications, such as robotics, machine vision, and control systems. 3. Automotive: The XCZU15EG-2FFVC900E chip can be used in automotive applications, including advanced driver-assistance systems (ADAS), infotainment systems, and in-vehicle networking. 4. Aerospace and Defense: The chip's high-performance processing and programmable logic resources make it suitable for aerospace and defense applications, such as radar systems, avionics, and communication systems. 5. Data Centers: The XCZU15EG-2FFVC900E chip can be utilized in data centers for tasks like acceleration of machine learning algorithms, network processing, and storage optimization.These are just a few examples of the advantages and application scenarios of the XCZU15EG-2FFVC900E integrated circuit chip. The specific usage depends on the requirements and design goals of the application.
MAX4559CEE+ Relevant information