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MAX4052ACEE+

MAX4052ACEE+

Manufacturer No:

MAX4052ACEE+

Description:

IC SWITCH SP4T X 2 100OHM 16QSOP

Datasheet:

Datasheet

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MAX4052ACEE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-QSOP
  • Package / Case
    16-SSOP (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -90dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    2pF, 2pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    175ns, 150ns
  • Voltage - Supply, Dual (V±)
    ±2.7V ~ 8V
  • Voltage - Supply, Single (V+)
    2V ~ 16V
  • Channel-to-Channel Matching (ΔRon)
    6Ohm (Max)
  • On-State Resistance (Max)
    100Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    4:1
  • Switch Circuit
    SP4T
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S050S-1FGG896I is an integrated circuit chip from Microsemi, which belongs to their SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S050S-1FGG896I chip combines an FPGA fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible programmability and the ability to execute complex tasks efficiently. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features like secure boot, tamper detection, and bitstream encryption. This makes the M2S050S-1FGG896I suitable for applications that require secure and reliable operation. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 processor combination provides high-performance computing capabilities, enabling the chip to handle complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S050S-1FGG896I chip can be used in industrial automation applications, such as motor control, robotics, and process control. Its FPGA fabric allows for customization and adaptation to specific requirements, while the microcontroller subsystem can handle real-time control tasks. 2. Internet of Things (IoT): With its low power consumption and integration capabilities, the chip is suitable for IoT applications. It can be used in sensor nodes, edge computing devices, or gateways, where it can perform data processing, communication, and security functions. 3. Aerospace and defense: The M2S050S-1FGG896I chip's security features make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication devices, or military equipment, where data integrity and protection are critical. 4. Medical devices: The chip's combination of programmability and real-time processing capabilities makes it suitable for medical devices. It can be used in applications like patient monitoring, medical imaging, or laboratory equipment, where customization, performance, and security are important. 5. Communications: The chip's FPGA fabric can be utilized for implementing communication protocols, signal processing, or encryption algorithms. It can be used in networking equipment, software-defined radios, or secure communication devices.These are just a few examples of the advantages and application scenarios of the M2S050S-1FGG896I chip. The versatility and integration of this chip make it suitable for a wide range of applications that require programmability, performance, and security.
MAX4052ACEE+ Relevant information