MAX320ESA+

MAX320ESA+

Manufacturer No:

MAX320ESA+

Description:

IC SWITCH SPST-NOX2 35OHM 8SOIC

Datasheet:

Datasheet

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MAX320ESA+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -85dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    9pF, 9pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    150ns, 100ns
  • Voltage - Supply, Dual (V±)
    ±2.7V ~ 8V
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    300mOhm
  • On-State Resistance (Max)
    35Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S100T-1FCG1152I is an integrated circuit chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S100T-1FCG1152I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features like secure boot, tamper detection, and secure key storage. This makes the M2S100T-1FCG1152I chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling complex applications and real-time processing.Application scenarios: 1. Industrial automation: The M2S100T-1FCG1152I chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization of I/O interfaces and real-time processing, while the microcontroller subsystem handles control algorithms and communication protocols. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller, the chip can be used in IoT devices that require both hardware flexibility and software programmability. It can handle sensor data processing, communication protocols, and security features. 3. Aerospace and defense: The M2S100T-1FCG1152I chip's security features, low power consumption, and high-performance processing make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication systems, or military-grade embedded systems. 4. Medical devices: The chip's integration, low power consumption, and security features make it suitable for medical devices like patient monitoring systems, portable medical devices, or implantable devices. It can handle data processing, communication, and security requirements. 5. Automotive: The M2S100T-1FCG1152I chip can be used in automotive applications like advanced driver-assistance systems (ADAS), infotainment systems, or engine control units. Its FPGA fabric allows for customization of interfaces and real-time processing, while the microcontroller subsystem handles control algorithms and communication protocols.These are just a few examples of the advantages and application scenarios of the M2S100T-1FCG1152I chip. The versatility and integration of this chip make it suitable for a wide range of applications where both hardware customization and software programmability are required.