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ADG1434YCPZ-REEL

ADG1434YCPZ-REEL

Manufacturer No:

ADG1434YCPZ-REEL

Manufacturer:

Analog Devices Inc.

Description:

IC SWITCH SPDTX4 4.7OHM 20LFCSP

Datasheet:

Datasheet

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ADG1434YCPZ-REEL Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-LFCSP (4x4)
  • Package / Case
    20-WFQFN Exposed Pad, CSP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -70dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    300pA
  • Channel Capacitance (CS(off), CD(off))
    12pF, 22pF
  • Charge Injection
    -50pC
  • -3db Bandwidth
    200MHz
  • Switch Time (Ton, Toff) (Max)
    170ns, 75ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 16.5V
  • Voltage - Supply, Single (V+)
    5V ~ 16.5V
  • Channel-to-Channel Matching (ΔRon)
    500mOhm
  • On-State Resistance (Max)
    4.7Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The XCZU3CG-1SFVA625E is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The XCZU3CG-1SFVA625E combines a high-performance processing system (Quad-core ARM Cortex-A53) with programmable logic (FPGA) in a single chip. This allows for a wide range of applications and flexibility in system design. 2. High-performance processing: The ARM Cortex-A53 cores provide powerful processing capabilities, enabling complex tasks such as real-time processing, image and signal processing, and high-speed data processing. 3. Programmable logic: The FPGA fabric in the chip allows for hardware acceleration, custom logic implementation, and real-time processing of specific algorithms. It can be reprogrammed to adapt to changing requirements or to optimize performance. 4. Integrated peripherals: The chip includes various peripherals such as USB, Ethernet, PCIe, and memory interfaces, reducing the need for additional external components and simplifying system design. 5. Low power consumption: The XCZU3CG-1SFVA625E is designed to be power-efficient, making it suitable for applications with strict power constraints.Application scenarios: 1. Embedded systems: The XCZU3CG-1SFVA625E is commonly used in embedded systems where a combination of high-performance processing and programmable logic is required. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. Edge computing: With its processing power and FPGA fabric, the chip is suitable for edge computing applications where real-time processing and low latency are crucial. It can be used in edge AI, video analytics, and IoT gateways. 3. High-speed data processing: The XCZU3CG-1SFVA625E's FPGA fabric can be utilized for high-speed data processing tasks such as data compression, encryption, and protocol conversion. It is commonly used in networking equipment, data centers, and telecommunications systems. 4. Image and signal processing: The chip's processing capabilities make it suitable for applications involving image and signal processing, such as medical imaging, video processing, and radar systems. 5. Prototyping and development: The XCZU3CG-1SFVA625E can be used for rapid prototyping and development of custom hardware solutions. Its programmable logic allows for quick iterations and testing of different designs.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and constraints of the target system.
ADG1434YCPZ-REEL Relevant information