ADG408BRUZ-REEL

ADG408BRUZ-REEL

Manufacturer No:

ADG408BRUZ-REEL

Manufacturer:

Analog Devices Inc.

Description:

IC MUX 8:1 100OHM 16TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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ADG408BRUZ-REEL Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -85dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    11pF, 40pF
  • Charge Injection
    20pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    -
  • Voltage - Supply, Dual (V±)
    ±15V
  • Voltage - Supply, Single (V+)
    12V
  • Channel-to-Channel Matching (ΔRon)
    15Ohm (Max)
  • On-State Resistance (Max)
    100Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The XC7Z045-2FBG676CES is a specific model of the Xilinx Zynq-7000 family of integrated circuit chips. These chips combine a dual-core ARM Cortex-A9 processor with programmable logic, making them suitable for a wide range of applications. Here are some advantages and application scenarios of the XC7Z045-2FBG676CES chips:Advantages: 1. High-performance processing: The dual-core ARM Cortex-A9 processor provides high-performance processing capabilities, making it suitable for applications that require significant computational power. 2. Programmable logic: The programmable logic fabric allows users to implement custom hardware accelerators, interfaces, and other specialized functionality, providing flexibility and customization options. 3. Low power consumption: The XC7Z045-2FBG676CES chips are designed to be power-efficient, making them suitable for battery-powered or energy-constrained applications. 4. Integrated peripherals: The chips come with a range of integrated peripherals, including USB, Ethernet, UART, SPI, I2C, and more, reducing the need for additional external components.Application scenarios: 1. Embedded systems: The XC7Z045-2FBG676CES chips are commonly used in embedded systems, where the combination of processing power and programmable logic allows for the implementation of complex algorithms and interfaces. 2. Industrial automation: These chips can be used in industrial automation applications, such as robotics, machine vision, and control systems, where real-time processing and custom hardware acceleration are required. 3. Communications and networking: The integrated peripherals and processing capabilities make the XC7Z045-2FBG676CES chips suitable for applications in communications and networking, including routers, switches, and wireless base stations. 4. Automotive electronics: The chips can be used in automotive electronics applications, such as advanced driver-assistance systems (ADAS), infotainment systems, and engine control units (ECUs), where a combination of processing power and custom hardware is required. 5. Aerospace and defense: The XC7Z045-2FBG676CES chips can be used in aerospace and defense applications, including avionics systems, radar processing, and secure communications, where high-performance processing and customization options are crucial.Overall, the XC7Z045-2FBG676CES chips offer a combination of processing power, programmable logic, and integrated peripherals, making them suitable for a wide range of applications that require high-performance processing and customization options.