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MAX4612ESD+

MAX4612ESD+

Manufacturer No:

MAX4612ESD+

Description:

IC SW SPST-NO/NCX4 100OHM 14SOIC

Datasheet:

Datasheet

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MAX4612ESD+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-SOIC
  • Package / Case
    14-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -80dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    16pF, 16pF
  • Charge Injection
    1pC
  • -3db Bandwidth
    300MHz
  • Switch Time (Ton, Toff) (Max)
    65ns, 28ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    2V ~ 12V
  • Channel-to-Channel Matching (ΔRon)
    1Ohm
  • On-State Resistance (Max)
    100Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO/NC
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S150-1FCS536I is an integrated circuit chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S150-1FCS536I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features like secure boot, tamper detection, and secure key storage. This makes the M2S150-1FCS536I chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling complex applications and real-time processing.Application scenarios: 1. Industrial automation: The M2S150-1FCS536I chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its low power consumption and integration of FPGA and microcontroller, the chip can be used in IoT devices for edge computing, data processing, and connectivity. 3. Aerospace and defense: The security features of the SmartFusion2 family make the M2S150-1FCS536I chip suitable for aerospace and defense applications that require secure communication, encryption, and protection against tampering. 4. Medical devices: The chip's versatility and integration make it suitable for medical devices like patient monitoring systems, medical imaging, and diagnostic equipment. 5. Communications and networking: The FPGA fabric can be used for protocol conversion, data processing, and signal conditioning in communication and networking equipment.These are just a few examples, and the M2S150-1FCS536I chip can be applied in various other domains where a combination of FPGA and microcontroller capabilities is required.
MAX4612ESD+ Relevant information