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MAX4852ETE+

MAX4852ETE+

Manufacturer No:

MAX4852ETE+

Description:

IC SWITCH SPDT X 2 4.5OHM 16TQFN

Datasheet:

Datasheet

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MAX4852ETE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TQFN (3x3)
  • Package / Case
    16-WFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -95dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    2nA
  • Channel Capacitance (CS(off), CD(off))
    20pF
  • Charge Injection
    8pC
  • -3db Bandwidth
    100MHz
  • Switch Time (Ton, Toff) (Max)
    60ns, 40ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    2V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    100mOhm
  • On-State Resistance (Max)
    4.5Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The MPC8360CVVAGDG is a highly integrated system-on-chip (SoC) designed by NXP Semiconductors. It belongs to the PowerQUICC II Pro family and offers several advantages and application scenarios:Advantages: 1. High Performance: The MPC8360CVVAGDG features a Power Architecture e300 core running at up to 667 MHz, providing excellent processing power for various applications. 2. Integrated Peripherals: It includes a wide range of integrated peripherals such as Ethernet controllers, USB ports, UARTs, I2C, SPI, and more, reducing the need for additional external components. 3. Security Features: The chip incorporates security features like secure boot, tamper detection, and cryptographic acceleration, making it suitable for applications requiring data protection. 4. Power Efficiency: The SoC is designed to be power-efficient, enabling longer battery life and reducing overall power consumption. 5. Scalability: The MPC8360CVVAGDG offers scalability options, allowing it to be used in a variety of applications with different performance and feature requirements.Application Scenarios: 1. Networking Equipment: The integrated Ethernet controllers and high-performance processing capabilities make it suitable for networking equipment such as routers, switches, and gateways. 2. Industrial Automation: The chip's robustness, security features, and support for various communication protocols make it ideal for industrial automation applications like programmable logic controllers (PLCs) and industrial gateways. 3. Telecommunications: With its high-performance processing, integrated peripherals, and security features, the MPC8360CVVAGDG can be used in telecommunications equipment like base stations, media gateways, and network appliances. 4. Automotive: The chip's power efficiency, integrated peripherals, and security features make it suitable for automotive applications such as infotainment systems, telematics, and advanced driver-assistance systems (ADAS). 5. Embedded Systems: The MPC8360CVVAGDG can be used in various embedded systems, including medical devices, consumer electronics, and smart appliances, where a combination of processing power, connectivity, and security is required.It's important to note that the specific application scenarios may vary depending on the system design and requirements.
MAX4852ETE+ Relevant information