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ADG411BRUZ-REEL7

ADG411BRUZ-REEL7

Manufacturer No:

ADG411BRUZ-REEL7

Manufacturer:

Analog Devices Inc.

Description:

IC SW SPST-NCX4 35OHM 16TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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ADG411BRUZ-REEL7 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -85dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    250pA
  • Channel Capacitance (CS(off), CD(off))
    9pF, 9pF
  • Charge Injection
    5pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    175ns, 145ns
  • Voltage - Supply, Dual (V±)
    ±15V
  • Voltage - Supply, Single (V+)
    12V
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    35Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NC
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The XAZU2EG-L1SFVA625I is a specific model of integrated circuit (IC) chip manufactured by Xilinx. It belongs to the Zynq UltraScale+ MPSoC family and offers several advantages and application scenarios. Here are some key points:Advantages: 1. High Performance: The XAZU2EG-L1SFVA625I chip combines a powerful Arm Cortex-A53 quad-core processor with a programmable logic fabric, providing high-performance processing capabilities. 2. Versatility: It offers a heterogeneous processing system, allowing users to leverage both the processing power of the Arm cores and the flexibility of programmable logic to implement a wide range of applications. 3. Integration: The chip integrates various components, including processors, memory interfaces, peripherals, and programmable logic, reducing the need for external components and simplifying system design. 4. Energy Efficiency: The chip is designed to optimize power consumption, making it suitable for applications where energy efficiency is crucial. 5. Scalability: The Zynq UltraScale+ MPSoC family offers different chip models with varying capabilities, allowing users to choose the most suitable option based on their application requirements.Application Scenarios: 1. Embedded Systems: The XAZU2EG-L1SFVA625I chip is commonly used in embedded systems that require high-performance processing and flexibility. It can be utilized in applications such as industrial automation, robotics, and automotive systems. 2. Edge Computing: With its processing power and programmable logic, the chip is suitable for edge computing applications where real-time processing and low latency are essential. It can be used in edge AI, video analytics, and IoT gateways. 3. Communications: The chip's integration of processors and programmable logic makes it suitable for communication systems that require signal processing, protocol handling, and network acceleration. 4. Aerospace and Defense: The XAZU2EG-L1SFVA625I chip's high performance and integration make it suitable for aerospace and defense applications, including radar systems, avionics, and secure communication systems. 5. High-Performance Computing: The chip's capabilities can be leveraged in high-performance computing applications, such as data centers and scientific research, where parallel processing and acceleration are crucial.It's important to note that the specific application scenarios may vary based on the system requirements and the capabilities of the XAZU2EG-L1SFVA625I chip.
ADG411BRUZ-REEL7 Relevant information