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DG408DVZ

DG408DVZ

Manufacturer No:

DG408DVZ

Description:

IC MUX 8:1 100OHM 16TSSOP

Datasheet:

Datasheet

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DG408DVZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    3pF, 26pF
  • Charge Injection
    20pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    150ns, 150ns
  • Voltage - Supply, Dual (V±)
    ±5V ~ 20V
  • Voltage - Supply, Single (V+)
    5V ~ 34V
  • Channel-to-Channel Matching (ΔRon)
    15Ohm (Max)
  • On-State Resistance (Max)
    100Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XC7Z030-3FBG676E is a specific model of the Xilinx Zynq-7000 family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance processing: The XC7Z030-3FBG676E chip combines a dual-core ARM Cortex-A9 processor with programmable logic, providing high-performance processing capabilities. 2. Programmable logic: The chip includes programmable logic resources, allowing users to implement custom hardware accelerators, interfaces, and other functionalities. 3. Low power consumption: The chip is designed to optimize power consumption, making it suitable for applications with strict power requirements. 4. Integrated peripherals: The XC7Z030-3FBG676E chip includes various peripherals such as USB, Ethernet, UART, SPI, I2C, and GPIO, enabling easy integration with external devices. 5. FPGA fabric: The chip incorporates FPGA fabric, allowing for flexible and customizable hardware designs.Application scenarios: 1. Embedded systems: The XC7Z030-3FBG676E chip is commonly used in embedded systems where both high-performance processing and programmable logic are required. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. Software-defined systems: The chip's programmable logic enables the implementation of software-defined functionalities, making it suitable for applications like software-defined radio, software-defined networking, and software-defined storage. 3. High-performance computing: The XC7Z030-3FBG676E chip's processing capabilities and FPGA fabric make it suitable for high-performance computing applications, including data centers, cloud computing, and scientific research. 4. Internet of Things (IoT): The chip's low power consumption and integrated peripherals make it suitable for IoT applications, such as smart home devices, wearable technology, and industrial IoT solutions. 5. Prototyping and development: The XC7Z030-3FBG676E chip is often used by engineers and developers for prototyping and development of custom hardware solutions, thanks to its combination of processing power and programmable logic.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and use cases of the project.
DG408DVZ Relevant information