CD4051BM

CD4051BM

Manufacturer No:

CD4051BM

Manufacturer:

Texas Instruments

Description:

IC MUX 8:1 240OHM 16SOIC

Datasheet:

Datasheet

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Payment:

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CD4051BM Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    100nA
  • Channel Capacitance (CS(off), CD(off))
    0.2pF, 30pF
  • Charge Injection
    -
  • -3db Bandwidth
    20MHz
  • Switch Time (Ton, Toff) (Max)
    -
  • Voltage - Supply, Dual (V±)
    ±2.5V ~ 9V
  • Voltage - Supply, Single (V+)
    3V ~ 20V
  • Channel-to-Channel Matching (ΔRon)
    5Ohm
  • On-State Resistance (Max)
    240Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Packaging
    Bulk
  • Product Status
    Last Time Buy
  • Series
    -
The M2S010S-1FG484I is an integrated circuit chip from Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S010S-1FG484I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features like secure boot, tamper detection, and secure key storage. This makes the M2S010S-1FG484I chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling complex applications and real-time processing.Application scenarios: 1. Industrial automation: The M2S010S-1FG484I chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller, the chip can be used in IoT devices for edge computing, data processing, and connectivity. The security features make it suitable for secure IoT applications. 3. Aerospace and defense: The chip's security features, low power consumption, and high performance make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication systems, and military-grade equipment. 4. Medical devices: The chip's versatility and integration make it suitable for medical devices like patient monitoring systems, medical imaging equipment, and diagnostic devices. The FPGA fabric allows for customization and adaptation to specific medical requirements. 5. Communications: The chip can be used in communication systems for tasks like protocol conversion, signal processing, and encryption. The FPGA fabric enables flexibility and adaptability to different communication standards.These are just a few examples of the advantages and application scenarios of the M2S010S-1FG484I chip. The versatility and integration of this chip make it suitable for a wide range of applications across various industries.