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CD74HC4051MT

CD74HC4051MT

Manufacturer No:

CD74HC4051MT

Manufacturer:

Texas Instruments

Description:

IC MUX 8:1 130OHM 16SOIC

Datasheet:

Datasheet

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CD74HC4051MT Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    400nA
  • Channel Capacitance (CS(off), CD(off))
    25pF
  • Charge Injection
    -
  • -3db Bandwidth
    180MHz
  • Switch Time (Ton, Toff) (Max)
    -
  • Voltage - Supply, Dual (V±)
    ±1V ~ 5V
  • Voltage - Supply, Single (V+)
    2V ~ 6V
  • Channel-to-Channel Matching (ΔRon)
    5Ohm
  • On-State Resistance (Max)
    130Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Last Time Buy
  • Series
    -
The BCM53570B0IFSBG is a specific model of integrated circuit chip developed by Broadcom. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for the BCM53570B0IFSBG:Advantages: 1. High Performance: The BCM53570B0IFSBG chip is designed to deliver high-performance networking capabilities, making it suitable for demanding applications. 2. Integration: It integrates multiple functions and features into a single chip, reducing the need for additional components and simplifying the overall system design. 3. Power Efficiency: The chip is designed to be power-efficient, helping to reduce energy consumption and extend battery life in portable devices. 4. Scalability: The chip offers scalability options, allowing it to be used in a wide range of applications, from small-scale deployments to large-scale networks. 5. Security: The BCM53570B0IFSBG chip incorporates security features to help protect against various threats and vulnerabilities.Application Scenarios: 1. Enterprise Networking: The chip can be used in enterprise networking equipment such as switches, routers, and access points, providing high-performance and secure connectivity for businesses. 2. Data Centers: The chip's high-performance capabilities make it suitable for data center networking applications, enabling efficient and reliable data transmission. 3. Service Provider Networks: The chip can be used in service provider networks to deliver high-speed and reliable connectivity for various services, such as internet access, voice, and video. 4. Smart Home and IoT: The chip's integration and power efficiency make it suitable for smart home devices and Internet of Things (IoT) applications, enabling connectivity and control of various devices. 5. Wireless Infrastructure: The chip can be used in wireless infrastructure equipment, such as base stations and access points, to provide high-speed wireless connectivity and manage network traffic efficiently.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and capabilities of the chip, and it's always recommended to refer to the manufacturer's documentation and specifications for accurate information.
CD74HC4051MT Relevant information