TS5A23157DGST

TS5A23157DGST

Manufacturer No:

TS5A23157DGST

Manufacturer:

Texas Instruments

Description:

IC SWITCH SPDT X 2 10OHM 10VSSOP

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

TS5A23157DGST Specifications

  • Type
    Parameter
  • Supplier Device Package
    10-VSSOP
  • Package / Case
    10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -66dB @ 10MHz
  • Current - Leakage (IS(off)) (Max)
    1µA
  • Channel Capacitance (CS(off), CD(off))
    5.5pF
  • Charge Injection
    7pC
  • -3db Bandwidth
    220MHz
  • Switch Time (Ton, Toff) (Max)
    5.7ns, 3.8ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.65V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    150mOhm
  • On-State Resistance (Max)
    10Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The XCZU2CG-1SFVA625E is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The XCZU2CG-1SFVA625E combines a high-performance processing system (Quad-core ARM Cortex-A53) with programmable logic (FPGA) in a single chip. This allows for a wide range of applications and flexibility in system design. 2. High-performance processing: The ARM Cortex-A53 cores provide powerful processing capabilities, making it suitable for applications that require significant computational power. 3. Programmable logic: The integrated FPGA allows for hardware acceleration, customization, and real-time processing, enabling the implementation of complex algorithms and high-speed data processing. 4. Low power consumption: The chip is designed to optimize power efficiency, making it suitable for applications where power consumption is a concern. 5. High-speed interfaces: The XCZU2CG-1SFVA625E supports various high-speed interfaces like PCIe, DDR4, USB 3.0, and Gigabit Ethernet, enabling connectivity with other devices and systems.Application scenarios: 1. Embedded systems: The XCZU2CG-1SFVA625E is commonly used in embedded systems where both high-performance processing and programmable logic are required. It can be used in applications like industrial automation, robotics, and automotive systems. 2. Software-defined networking (SDN): The chip's FPGA can be utilized to implement network functions, such as packet processing, traffic management, and security, making it suitable for SDN applications. 3. High-performance computing (HPC): The XCZU2CG-1SFVA625E can be used in HPC applications that require significant computational power and real-time processing, such as scientific simulations, data analytics, and machine learning. 4. Video and image processing: The chip's FPGA can be leveraged for real-time video and image processing tasks, including video encoding/decoding, computer vision, and multimedia applications. 5. Aerospace and defense: The XCZU2CG-1SFVA625E's combination of processing power and programmable logic makes it suitable for aerospace and defense applications, such as radar systems, communication systems, and avionics.It's important to note that the specific use cases and applications may vary depending on the system requirements and the expertise of the designers.