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PI3USB4000DQ1ZUAEX

PI3USB4000DQ1ZUAEX

Manufacturer No:

PI3USB4000DQ1ZUAEX

Manufacturer:

Diodes Incorporated

Description:

IC SWITCH SPDT X 1 10OHM 10UQFN

Datasheet:

Datasheet

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PI3USB4000DQ1ZUAEX Specifications

  • Type
    Parameter
  • Supplier Device Package
    10-UQFN (1.5x2)
  • Package / Case
    10-UFQFN
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -35dB @ 240MHz
  • Current - Leakage (IS(off)) (Max)
    1µA
  • Channel Capacitance (CS(off), CD(off))
    5pF
  • Charge Injection
    -
  • -3db Bandwidth
    1GHz
  • Switch Time (Ton, Toff) (Max)
    100µs, 50ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    2.7V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    500mOhm
  • On-State Resistance (Max)
    10Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100
The M2S090-1FGG676I is an integrated circuit chip from Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S090-1FGG676I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features like secure boot, tamper detection, and secure key storage. This makes the M2S090-1FGG676I chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S090-1FGG676I chip can be used in industrial automation applications, such as motor control, robotics, and process control. Its FPGA fabric allows for custom logic implementation, while the microcontroller subsystem can handle real-time control tasks. 2. Internet of Things (IoT): With its low power consumption and security features, the chip is suitable for IoT applications, including edge computing, sensor data processing, and secure communication. 3. Aerospace and defense: The M2S090-1FGG676I chip's combination of FPGA and microcontroller subsystem makes it suitable for aerospace and defense applications, such as avionics, radar systems, and secure communication. 4. Medical devices: The chip's versatility and security features make it suitable for medical device applications, including patient monitoring, diagnostic equipment, and medical imaging. 5. Communications: The M2S090-1FGG676I chip can be used in communication systems, such as network routers, switches, and wireless base stations, where its FPGA fabric can be utilized for protocol processing and the microcontroller subsystem for control functions.These are just a few examples of the advantages and application scenarios of the M2S090-1FGG676I chip. Its versatility and integration make it suitable for a wide range of applications that require a combination of programmability, processing power, and security.
PI3USB4000DQ1ZUAEX Relevant information