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TS5A3166QDCKRQ1

TS5A3166QDCKRQ1

Manufacturer No:

TS5A3166QDCKRQ1

Manufacturer:

Texas Instruments

Description:

IC SW SPST-NOX1 900MOHM SC70-5

Datasheet:

Datasheet

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TS5A3166QDCKRQ1 Specifications

  • Type
    Parameter
  • Supplier Device Package
    SC-70-5
  • Package / Case
    5-TSSOP, SC-70-5, SOT-353
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    80nA
  • Channel Capacitance (CS(off), CD(off))
    19pF, 18pF
  • Charge Injection
    1pC
  • -3db Bandwidth
    200MHz
  • Switch Time (Ton, Toff) (Max)
    7ns, 11.5ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.65V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    900mOhm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100
The M2S090-1FG676 is an integrated circuit chip from Microsemi, which is a low-power, high-performance FPGA (Field-Programmable Gate Array). Here are some advantages and application scenarios of this chip:Advantages: 1. Low Power Consumption: The M2S090-1FG676 chip is designed to be power-efficient, making it suitable for battery-powered devices or applications where power consumption is a concern. 2. High Performance: It offers high-speed processing capabilities, enabling it to handle complex tasks and data-intensive applications. 3. Flexibility: Being an FPGA, the chip can be reprogrammed or reconfigured to perform different functions or adapt to changing requirements, providing flexibility in design and development. 4. Integration: The chip integrates various components like logic gates, memory blocks, and I/O interfaces, reducing the need for external components and simplifying the overall system design. 5. Reliability: Microsemi is known for its reliable and robust FPGA solutions, ensuring the M2S090-1FG676 chip's stability and durability.Application Scenarios: 1. Internet of Things (IoT): The low power consumption and flexibility of the M2S090-1FG676 chip make it suitable for IoT devices, where power efficiency and adaptability are crucial. 2. Industrial Automation: The chip's high performance and integration capabilities make it suitable for industrial automation applications, such as control systems, robotics, and machine vision. 3. Communications: The M2S090-1FG676 chip can be used in communication systems, including network routers, switches, and wireless base stations, where high-speed processing and low power consumption are essential. 4. Automotive: With its reliability and flexibility, the chip can be utilized in automotive applications like advanced driver-assistance systems (ADAS), infotainment systems, and engine control units. 5. Aerospace and Defense: The M2S090-1FG676 chip's high performance and reliability make it suitable for aerospace and defense applications, including avionics systems, radar systems, and secure communication systems.These are just a few examples of the advantages and application scenarios of the M2S090-1FG676 integrated circuit chip. Its versatility and capabilities make it suitable for a wide range of industries and applications.
TS5A3166QDCKRQ1 Relevant information