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TMUX1209PWR

TMUX1209PWR

Manufacturer No:

TMUX1209PWR

Manufacturer:

Texas Instruments

Description:

IC MUX DUAL 4:1 5OHM 16TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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TMUX1209PWR Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -62dB ~ -42dB @ 1MHz ~ 10MHz
  • Current - Leakage (IS(off)) (Max)
    75nA (Typ)
  • Channel Capacitance (CS(off), CD(off))
    13pF, 38pF
  • Charge Injection
    9pC
  • -3db Bandwidth
    125MHz
  • Switch Time (Ton, Toff) (Max)
    14ns, 5ns (Typ)
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    150mOhm
  • On-State Resistance (Max)
    5Ohm (Typ)
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    4:1
  • Switch Circuit
    -
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The IDT79RC32T351-100DHG is a specific model of integrated circuit (IC) chip manufactured by IDT (Integrated Device Technology). While specific advantages and application scenarios may vary depending on the requirements and context, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High Performance: The IDT79RC32T351-100DHG is designed to deliver high performance with a clock speed of 100 MHz. This makes it suitable for applications that require fast processing and real-time operations.2. Low Power Consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial.3. Integrated Features: The IDT79RC32T351-100DHG integrates various features such as a 32-bit RISC processor, memory management unit (MMU), cache, and peripherals. This integration simplifies the design process and reduces the need for additional components.4. Scalability: The chip supports various memory configurations, allowing for scalability based on the application requirements. This flexibility makes it suitable for a wide range of applications.Application Scenarios: 1. Embedded Systems: The IDT79RC32T351-100DHG can be used in embedded systems that require high-performance processing, such as industrial automation, robotics, or automotive applications.2. Communication Systems: The chip's integrated features and high clock speed make it suitable for communication systems that require real-time processing, such as network routers, switches, or telecommunication equipment.3. Consumer Electronics: The low power consumption and integrated features of the chip make it suitable for consumer electronics applications, such as smart home devices, wearable technology, or portable devices.4. Internet of Things (IoT): The IDT79RC32T351-100DHG can be used in IoT devices that require both processing power and power efficiency, such as smart sensors, edge computing devices, or IoT gateways.It's important to note that the specific advantages and application scenarios may vary based on the requirements and specifications of the project. It is recommended to consult the datasheet and technical documentation provided by IDT for detailed information on the chip's capabilities and limitations.
TMUX1209PWR Relevant information