CD4053BPWR

CD4053BPWR

Manufacturer No:

CD4053BPWR

Manufacturer:

Texas Instruments

Description:

IC SWITCH SPDTX3 240OHM 16TSSOP

Datasheet:

Datasheet

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Payment:

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CD4053BPWR Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C (TA)
  • Crosstalk
    -40dB @ 6MHz
  • Current - Leakage (IS(off)) (Max)
    100nA
  • Channel Capacitance (CS(off), CD(off))
    0.2pF, 9pF
  • Charge Injection
    -
  • -3db Bandwidth
    30MHz
  • Switch Time (Ton, Toff) (Max)
    -
  • Voltage - Supply, Dual (V±)
    ±2.5V ~ 9V
  • Voltage - Supply, Single (V+)
    3V ~ 20V
  • Channel-to-Channel Matching (ΔRon)
    5Ohm
  • On-State Resistance (Max)
    240Ohm
  • Number of Circuits
    3
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The MPC850SRVR50BU is a specific model of the MPC850 PowerQUICC microprocessor family developed by Freescale Semiconductor (now NXP Semiconductors). This microprocessor chip offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the MPC850SRVR50BU integrated circuit chips are:Advantages: 1. High Performance: The MPC850SRVR50BU chip is designed to deliver high performance with a clock speed of 50 MHz. It offers a powerful processing capability for various applications.2. PowerQUICC Architecture: The PowerQUICC architecture combines a PowerPC core with integrated communications peripherals, making it suitable for networking and communication applications.3. Integrated Peripherals: The chip includes various integrated peripherals such as Ethernet controllers, serial ports, timers, and general-purpose I/O pins. This integration reduces the need for additional external components, simplifying the design and reducing costs.4. Low Power Consumption: The MPC850SRVR50BU chip is designed to operate with low power consumption, making it suitable for applications where power efficiency is crucial.5. Industrial Temperature Range: The chip is designed to operate within an extended industrial temperature range, typically from -40°C to +85°C. This makes it suitable for applications in harsh environments.Application Scenarios: 1. Networking Equipment: The MPC850SRVR50BU chip is commonly used in networking equipment such as routers, switches, and gateways. Its high performance and integrated communication peripherals make it suitable for handling network protocols and data processing.2. Industrial Automation: The chip's low power consumption and industrial temperature range make it suitable for industrial automation applications. It can be used in programmable logic controllers (PLCs), motor control systems, and other automation devices.3. Embedded Systems: The MPC850SRVR50BU chip can be used in various embedded systems where a combination of processing power and communication capabilities is required. It can be applied in applications such as automotive systems, medical devices, and aerospace systems.4. Communication Infrastructure: The chip's integrated Ethernet controllers and communication peripherals make it suitable for communication infrastructure applications. It can be used in base stations, access points, and other communication equipment.5. Internet of Things (IoT): With its low power consumption and integrated communication capabilities, the chip can be used in IoT devices. It can enable connectivity and processing capabilities in IoT edge devices, allowing them to communicate and interact with other devices or cloud services.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and use cases of the system being designed.