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SN74LVC1G3157YZPR

SN74LVC1G3157YZPR

Manufacturer No:

SN74LVC1G3157YZPR

Manufacturer:

Texas Instruments

Description:

IC SWITCH SPDT X 1 15OHM 6DSBGA

Datasheet:

Datasheet

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SN74LVC1G3157YZPR Specifications

  • Type
    Parameter
  • Supplier Device Package
    6-DSBGA (1.39x.89)
  • Package / Case
    6-XFBGA, DSBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -54dB @ 10MHz
  • Current - Leakage (IS(off)) (Max)
    1µA
  • Channel Capacitance (CS(off), CD(off))
    5.2pF
  • Charge Injection
    7pC
  • -3db Bandwidth
    340MHz
  • Switch Time (Ton, Toff) (Max)
    5.7ns, 3.8ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.65V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    100mOhm
  • On-State Resistance (Max)
    15Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74LVC
The 5CSEMA6F31I7N is an integrated circuit chip from Intel's Cyclone V series of Field-Programmable Gate Arrays (FPGAs). Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The 5CSEMA6F31I7N chip offers high-speed processing capabilities, making it suitable for applications that require real-time data processing and high-performance computing. 2. Flexibility: Being an FPGA, it allows for reprogramming and customization of the chip's functionality even after deployment. This flexibility makes it suitable for applications that require frequent updates or changes in functionality. 3. Low Power Consumption: The chip is designed to be power-efficient, making it suitable for battery-powered or energy-constrained applications. 4. Integration: The 5CSEMA6F31I7N chip integrates various components like logic elements, memory blocks, and digital signal processing (DSP) blocks, reducing the need for external components and simplifying the overall system design.Application Scenarios: 1. Embedded Systems: The chip can be used in various embedded systems applications, such as industrial automation, robotics, and Internet of Things (IoT) devices. Its high performance and flexibility allow for real-time control and processing of data in these applications. 2. Communications: The 5CSEMA6F31I7N chip can be used in communication systems, including wireless base stations, routers, and network switches. Its high-speed processing capabilities and integration of DSP blocks make it suitable for handling data-intensive communication tasks. 3. Video and Image Processing: The chip's high-performance computing capabilities and integration of DSP blocks make it suitable for video and image processing applications, such as video surveillance, medical imaging, and multimedia systems. 4. Automotive: The chip can be used in automotive applications, including advanced driver-assistance systems (ADAS), infotainment systems, and vehicle control units. Its flexibility allows for customization and adaptation to different automotive requirements. 5. Aerospace and Defense: The 5CSEMA6F31I7N chip can be used in aerospace and defense applications, such as radar systems, avionics, and military communication systems. Its high performance, low power consumption, and reprogrammability make it suitable for these demanding applications.It's important to note that the specific application scenarios may vary depending on the system requirements and the overall design considerations.
SN74LVC1G3157YZPR Relevant information