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74HCT4052BQ,115

74HCT4052BQ,115

Manufacturer No:

74HCT4052BQ,115

Manufacturer:

Nexperia USA Inc.

Description:

IC SWITCH SP4TX2 150OHM 16DHVQFN

Datasheet:

Datasheet

Delivery:

Payment:

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74HCT4052BQ,115 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-DHVQFN (2.5x3.5)
  • Package / Case
    16-VFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -60dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    2µA
  • Channel Capacitance (CS(off), CD(off))
    3.5pF
  • Charge Injection
    -
  • -3db Bandwidth
    180MHz
  • Switch Time (Ton, Toff) (Max)
    60ns, 48ns
  • Voltage - Supply, Dual (V±)
    ±1V ~ 5V
  • Voltage - Supply, Single (V+)
    4.5V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    6Ohm
  • On-State Resistance (Max)
    150Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    4:1
  • Switch Circuit
    SP4T
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The M2S090-FGG676 is an integrated circuit chip developed by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of the M2S090-FGG676:Advantages: 1. Versatility: The M2S090-FGG676 combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family, including the M2S090-FGG676, offers advanced security features such as secure boot, tamper detection, and secure key storage. These features make it suitable for applications that require high levels of security. 4. Low power consumption: The M2S090-FGG676 is designed to be power-efficient, making it suitable for battery-powered or energy-constrained applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling the chip to handle complex tasks and algorithms.Application scenarios: 1. Industrial automation: The M2S090-FGG676 can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. Its flexibility allows for customization to specific industrial requirements. 2. Internet of Things (IoT): With its low power consumption and integration capabilities, the chip can be used in IoT devices for edge computing, data processing, and connectivity. 3. Aerospace and defense: The M2S090-FGG676's security features make it suitable for aerospace and defense applications that require secure boot, encryption, and protection against tampering. 4. Medical devices: The chip can be used in medical devices for tasks such as signal processing, data acquisition, and control algorithms. Its integration and customization capabilities enable the development of specialized medical equipment. 5. Communications: The M2S090-FGG676 can be used in communication systems for tasks such as protocol handling, encryption, and signal processing. Its high-performance capabilities make it suitable for demanding communication applications.These are just a few examples of the advantages and application scenarios of the M2S090-FGG676. The chip's versatility and integration make it suitable for a wide range of industries and applications where a combination of FPGA and microcontroller capabilities is required.
74HCT4052BQ,115 Relevant information