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MC74HC4851ADR2G

MC74HC4851ADR2G

Manufacturer No:

MC74HC4851ADR2G

Manufacturer:

onsemi

Description:

IC MUX 8:1 400OHM 16SOIC

Datasheet:

Datasheet

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MC74HC4851ADR2G Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    100nA
  • Channel Capacitance (CS(off), CD(off))
    40pF
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    -
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    2V ~ 6V
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    400Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The XLP316LXD0800-21 integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low Power Consumption: These chips are designed to operate at ultra-low power levels, making them suitable for battery-powered devices and energy-efficient applications. 2. High Performance: Despite their low power consumption, these chips offer high performance capabilities, enabling them to handle complex tasks efficiently. 3. Integrated Features: The XLP316LXD0800-21 chips come with various integrated features such as analog-to-digital converters (ADCs), digital-to-analog converters (DACs), timers, and communication interfaces, reducing the need for external components. 4. Small Form Factor: These chips are available in small package sizes, making them suitable for space-constrained applications and compact devices. 5. Wide Operating Voltage Range: The chips can operate within a wide voltage range, allowing them to be used in various power supply configurations.Application Scenarios: 1. Internet of Things (IoT) Devices: The low power consumption and integrated features of these chips make them ideal for IoT devices such as smart sensors, wearable devices, and home automation systems. 2. Portable Electronics: The XLP316LXD0800-21 chips can be used in portable electronics like smartphones, tablets, and handheld devices, where power efficiency and compact size are crucial. 3. Industrial Automation: These chips can be employed in industrial automation systems for tasks such as data acquisition, control, and monitoring, thanks to their low power consumption and integrated capabilities. 4. Medical Devices: The high performance and low power consumption of these chips make them suitable for medical devices like patient monitoring systems, portable medical instruments, and implantable devices. 5. Energy Management Systems: The XLP316LXD0800-21 chips can be utilized in energy management systems for smart grid applications, energy monitoring, and control, enabling efficient energy usage.Overall, the XLP316LXD0800-21 integrated circuit chips offer a combination of low power consumption, high performance, and integrated features, making them versatile for various applications in different industries.
MC74HC4851ADR2G Relevant information