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DG406EWI+

DG406EWI+

Manufacturer No:

DG406EWI+

Description:

IC MUX 16:1 100OHM 28SOIC

Datasheet:

Datasheet

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DG406EWI+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-SOIC
  • Package / Case
    28-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -92dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    8pF, 130pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    200ns, 150ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    5V ~ 30V
  • Channel-to-Channel Matching (ΔRon)
    1.5Ohm
  • On-State Resistance (Max)
    100Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    16:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XCZU46DR-L1FSVH1760I is a specific model of integrated circuit (IC) chip from Xilinx. It belongs to the Xilinx Zynq UltraScale+ MPSoC family and offers several advantages and application scenarios. Here are some key points:Advantages: 1. High Performance: The XCZU46DR-L1FSVH1760I chip provides high-performance processing capabilities with a combination of programmable logic and processing system. 2. Versatility: It offers a heterogeneous processing system with a combination of ARM Cortex-A53 cores and programmable logic, allowing for flexible and customizable designs. 3. Integration: The chip integrates various components like processors, memory, and programmable logic on a single chip, reducing the need for external components and simplifying system design. 4. Power Efficiency: The XCZU46DR-L1FSVH1760I chip is designed to be power-efficient, enabling longer battery life and reducing power consumption in applications. 5. Scalability: It supports scalability, allowing for different configurations and sizes based on the specific application requirements.Application Scenarios: 1. Embedded Systems: The XCZU46DR-L1FSVH1760I chip is suitable for embedded systems that require high-performance processing, such as industrial automation, robotics, and automotive applications. 2. Edge Computing: With its heterogeneous processing capabilities, the chip can be used in edge computing scenarios where real-time processing and low latency are crucial, such as video analytics, IoT gateways, and smart surveillance systems. 3. High-Performance Computing: The XCZU46DR-L1FSVH1760I chip can be utilized in high-performance computing applications that require parallel processing, such as scientific simulations, data analytics, and machine learning. 4. Communications and Networking: It can be employed in networking equipment, routers, and switches that require high-speed data processing and low-latency communication. 5. Aerospace and Defense: The chip's performance, integration, and power efficiency make it suitable for aerospace and defense applications, including radar systems, avionics, and secure communication systems.These are just a few examples, and the XCZU46DR-L1FSVH1760I chip can be used in various other domains where high-performance processing, flexibility, and integration are required.
DG406EWI+ Relevant information