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MAX308CUE+

MAX308CUE+

Manufacturer No:

MAX308CUE+

Description:

IC MUX 8:1 100OHM 16TSSOP

Datasheet:

Datasheet

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MAX308CUE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -92dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    750pA
  • Channel Capacitance (CS(off), CD(off))
    3pF, 26pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    150ns, 150ns
  • Voltage - Supply, Dual (V±)
    ±5V ~ 20V
  • Voltage - Supply, Single (V+)
    5V ~ 30V
  • Channel-to-Channel Matching (ΔRon)
    1.5Ohm
  • On-State Resistance (Max)
    100Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The MPC8544EDVTANG is a specific model of the PowerQUICC III integrated circuit chip developed by NXP Semiconductors. This chip is designed for networking and communication applications and offers several advantages and application scenarios:1. High Performance: The MPC8544EDVTANG chip is built on a Power Architecture core, providing high-performance processing capabilities. It features a 1.33 GHz e500v2 core, which enables efficient execution of complex networking tasks.2. Networking Capabilities: This chip is specifically designed for networking applications, making it suitable for various networking equipment such as routers, switches, gateways, and network appliances. It supports various networking protocols and interfaces, including Ethernet, USB, PCI, and Serial RapidIO.3. Integrated Security Features: The MPC8544EDVTANG chip incorporates security features like secure boot, secure key storage, and cryptographic acceleration. These features enhance the security of network devices and protect against potential threats.4. Power Efficiency: The PowerQUICC III architecture is optimized for power efficiency, making it suitable for devices that require low power consumption. This is particularly important for networking equipment that needs to operate continuously while minimizing energy consumption.5. Scalability: The MPC8544EDVTANG chip offers scalability, allowing it to be used in a range of networking applications. It supports multiple cores, enabling the development of high-performance and multi-threaded networking devices.6. Industrial Applications: The chip's robust design and reliability make it suitable for industrial applications that require high-performance networking capabilities. It can be used in industrial automation, smart grid systems, transportation, and other industrial networking solutions.7. Telecommunications: The MPC8544EDVTANG chip can be utilized in telecommunications infrastructure, including base stations, media gateways, and network switches. Its high-performance processing and networking capabilities enable efficient data handling and communication in telecommunications networks.Overall, the MPC8544EDVTANG integrated circuit chip offers high-performance networking capabilities, integrated security features, power efficiency, scalability, and suitability for industrial and telecommunications applications.
MAX308CUE+ Relevant information