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MAX4708ESE+

MAX4708ESE+

Manufacturer No:

MAX4708ESE+

Description:

IC MUX 8:1 400OHM 16SOIC

Datasheet:

Datasheet

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MAX4708ESE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -62dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    10pF, 19pF
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    275ns, 200ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    9V ~ 36V
  • Channel-to-Channel Matching (ΔRon)
    15Ohm (Max)
  • On-State Resistance (Max)
    400Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S100-1FC1152 is an integrated circuit chip developed by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of the M2S100-1FC1152:Advantages: 1. Versatility: The M2S100-1FC1152 combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features such as secure boot, tamper detection, and secure key storage. This makes the M2S100-1FC1152 suitable for applications that require robust security measures. 4. Low power consumption: The M2S100-1FC1152 is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications.Application scenarios: 1. Industrial automation: The M2S100-1FC1152 can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller, the M2S100-1FC1152 is suitable for IoT applications. It can handle sensor data processing, communication protocols, and security features required in IoT devices. 3. Aerospace and defense: The M2S100-1FC1152's security features, low power consumption, and integration make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication devices, and military-grade equipment. 4. Medical devices: The chip's versatility and security features make it suitable for medical devices such as patient monitoring systems, medical imaging equipment, and portable diagnostic devices. 5. Communications: The M2S100-1FC1152 can be used in communication systems, including network routers, switches, and wireless base stations. The FPGA fabric allows for customization and optimization of communication protocols.These are just a few examples of the advantages and application scenarios of the M2S100-1FC1152. The chip's versatility and integration make it suitable for a wide range of industries and applications where customization, security, and low power consumption are important.
MAX4708ESE+ Relevant information