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DG508ADY+

DG508ADY+

Manufacturer No:

DG508ADY+

Description:

IC MUX 8:1 450OHM 16SOIC

Datasheet:

Datasheet

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DG508ADY+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    1nA
  • Channel Capacitance (CS(off), CD(off))
    5pF, 25pF
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    1.5µs, 1µs
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 18V
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    27Ohm
  • On-State Resistance (Max)
    450Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The SVF522R3K2CMK4 integrated circuit chips have several advantages and application scenarios:1. High Performance: These chips are designed for high-performance computing applications, offering fast processing speeds and efficient data handling capabilities.2. Scalability: The chips are highly scalable, allowing for easy integration into various systems and applications. They can be used in a wide range of industries, including telecommunications, data centers, and cloud computing.3. Energy Efficiency: The SVF522R3K2CMK4 chips are designed to be energy-efficient, helping to reduce power consumption and operating costs in applications where power efficiency is crucial.4. Advanced Features: These chips come with advanced features such as multi-core processing, high-speed interconnects, and large memory capacity, enabling them to handle complex tasks and large data sets.5. Application Scenarios: The SVF522R3K2CMK4 chips can be used in various scenarios, including: - Data Centers: These chips can be used in data centers to handle large-scale data processing, storage, and networking tasks. - Artificial Intelligence (AI): The high-performance capabilities of these chips make them suitable for AI applications, such as machine learning, deep learning, and neural networks. - High-Performance Computing (HPC): The chips can be used in HPC applications, including scientific simulations, weather forecasting, and financial modeling, where fast processing speeds and efficient data handling are essential. - Network Infrastructure: These chips can be used in network infrastructure equipment, such as routers and switches, to handle high-speed data transmission and routing tasks. - Virtualization: The chips can be used in virtualization environments, enabling efficient resource allocation and management in cloud computing and virtualized server environments.Overall, the SVF522R3K2CMK4 integrated circuit chips offer high performance, scalability, energy efficiency, and advanced features, making them suitable for a wide range of applications in various industries.
DG508ADY+ Relevant information