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MAX14756EUE+

MAX14756EUE+

Manufacturer No:

MAX14756EUE+

Description:

IC SW SPST-NCX4 10OHM 16TSSOP

Datasheet:

Datasheet

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MAX14756EUE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -96dB @ 10MHz
  • Current - Leakage (IS(off)) (Max)
    2.5nA
  • Channel Capacitance (CS(off), CD(off))
    35pF
  • Charge Injection
    580pC
  • -3db Bandwidth
    145MHz
  • Switch Time (Ton, Toff) (Max)
    60µs, 3µs
  • Voltage - Supply, Dual (V±)
    ±10V ~ 35V
  • Voltage - Supply, Single (V+)
    10V ~ 70V
  • Channel-to-Channel Matching (ΔRon)
    300mOhm
  • On-State Resistance (Max)
    10Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NC
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S090S-1FG676I is an integrated circuit chip from Microsemi Corporation, which is a programmable logic device (PLD) based on the SmartFusion2 FPGA architecture. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S090S-1FG676I chip offers a high level of flexibility and configurability, allowing users to implement a wide range of functions and logic designs. 2. Integration: It combines FPGA fabric with a hard ARM Cortex-M3 microcontroller subsystem, providing a single-chip solution for both programmable logic and microcontroller-based applications. 3. Security: The chip includes security features like secure boot, tamper detection, and bitstream encryption, making it suitable for applications that require robust security measures. 4. Low power consumption: The SmartFusion2 architecture is designed to optimize power efficiency, making it suitable for battery-powered or energy-conscious applications. 5. High performance: With a combination of FPGA fabric and a 32-bit ARM Cortex-M3 processor, the chip offers high-performance computing capabilities.Application scenarios: 1. Industrial automation: The M2S090S-1FG676I chip can be used in industrial control systems, programmable logic controllers (PLCs), and motor control applications, providing real-time processing, connectivity, and flexibility. 2. Aerospace and defense: The chip's security features make it suitable for applications in aerospace and defense, such as secure communication systems, avionics, and military-grade equipment. 3. Internet of Things (IoT): With its low power consumption and integration capabilities, the chip can be used in IoT devices, enabling edge computing, sensor integration, and connectivity. 4. Medical devices: The chip can be utilized in medical devices like patient monitoring systems, medical imaging equipment, and diagnostic devices, providing high-performance processing and security features. 5. Communications: The M2S090S-1FG676I chip can be used in networking equipment, routers, and switches, offering high-speed data processing, connectivity, and security.These are just a few examples of the advantages and application scenarios of the M2S090S-1FG676I integrated circuit chip. The actual usage depends on the specific requirements and design considerations of the target application.
MAX14756EUE+ Relevant information