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DG412DY+

DG412DY+

Manufacturer No:

DG412DY+

Description:

IC SWITCH SPST-NOX4 45OHM 16SOIC

Datasheet:

Datasheet

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DG412DY+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -85dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    250pA
  • Channel Capacitance (CS(off), CD(off))
    9pF, 9pF
  • Charge Injection
    5pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    175ns, 145ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    10V ~ 30V
  • Channel-to-Channel Matching (ΔRon)
    3Ohm (Max)
  • On-State Resistance (Max)
    45Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XCZU1EG-2SFVA625I is a specific model of the Xilinx Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) family. Here are some advantages and application scenarios of this integrated circuit chip:Advantages: 1. High-performance processing: The XCZU1EG-2SFVA625I chip combines a processing system (Quad-core ARM Cortex-A53) with programmable logic (FPGA) to provide high-performance processing capabilities. 2. Versatility: The chip offers a combination of processing power and programmable logic, making it suitable for a wide range of applications. 3. Power efficiency: The Zynq UltraScale+ architecture is designed to optimize power consumption, making it suitable for applications with power constraints. 4. Scalability: The chip supports scalability, allowing for the addition of custom hardware accelerators or IP cores to meet specific application requirements. 5. Integrated peripherals: The chip includes various peripherals such as USB, Ethernet, PCIe, and DDR memory controllers, reducing the need for additional external components.Application scenarios: 1. Embedded systems: The XCZU1EG-2SFVA625I chip is commonly used in embedded systems where high-performance processing and programmable logic are required. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. Edge computing: With its processing power and programmable logic, the chip is suitable for edge computing applications where real-time processing and low latency are crucial, such as video analytics, machine vision, and AI inference at the edge. 3. Communications: The chip's integrated peripherals and processing capabilities make it suitable for communication applications like wireless base stations, network switches, and routers. 4. High-performance computing: The XCZU1EG-2SFVA625I chip can be used in high-performance computing applications that require parallel processing and acceleration, such as scientific simulations, data analytics, and image processing. 5. Aerospace and defense: The chip's combination of processing power and programmable logic makes it suitable for aerospace and defense applications, including radar systems, avionics, and secure communication systems.It's important to note that the specific use cases and advantages may vary depending on the requirements and design choices of the application.
DG412DY+ Relevant information