ADG1422BRMZ

ADG1422BRMZ

Manufacturer No:

ADG1422BRMZ

Manufacturer:

Analog Devices Inc.

Description:

IC SW SPST-NCX2 2.4OHM 10MSOP

Datasheet:

Datasheet

Delivery:

Payment:

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ADG1422BRMZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    10-MSOP
  • Package / Case
    10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -74dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    18pF, 22pF
  • Charge Injection
    -5pC
  • -3db Bandwidth
    180MHz
  • Switch Time (Ton, Toff) (Max)
    145ns, 145ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 16.5V
  • Voltage - Supply, Single (V+)
    5V ~ 16.5V
  • Channel-to-Channel Matching (ΔRon)
    20mOhm
  • On-State Resistance (Max)
    2.4Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NC
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XC7Z100-2FFG900I is a specific model of the Xilinx Zynq-7000 family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance processing: The XC7Z100-2FFG900I chip combines a dual-core ARM Cortex-A9 processor with programmable logic, providing high-performance processing capabilities. 2. Programmable logic: The chip includes programmable logic resources, allowing users to implement custom hardware accelerators, interfaces, and other functionalities. 3. System integration: The chip integrates processing, memory, and I/O interfaces on a single device, reducing the need for external components and simplifying system design. 4. Low power consumption: The XC7Z100-2FFG900I chip is designed to be power-efficient, making it suitable for applications with strict power constraints. 5. Scalability: The Zynq-7000 family offers different models with varying levels of processing power, programmable logic resources, and I/O capabilities, allowing users to choose the most suitable chip for their application.Application scenarios: 1. Embedded systems: The XC7Z100-2FFG900I chip is commonly used in embedded systems that require both high-performance processing and custom hardware acceleration. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. Software-defined radio (SDR): The chip's programmable logic resources make it suitable for SDR applications, where custom signal processing algorithms can be implemented in hardware. 3. Video processing: The XC7Z100-2FFG900I chip's processing capabilities and programmable logic resources make it suitable for video processing applications, such as video surveillance, video analytics, and video encoding/decoding. 4. High-performance computing: The chip's dual-core ARM Cortex-A9 processor and programmable logic resources can be utilized for high-performance computing applications, such as data analytics, image processing, and scientific simulations. 5. Internet of Things (IoT): The XC7Z100-2FFG900I chip's integration of processing, memory, and I/O interfaces makes it suitable for IoT applications, where it can serve as a central processing unit for edge devices, enabling local data processing and connectivity.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and constraints of the target system.