Home / Analog Switches, Multiplexers, Demultiplexers / ADG708CRUZ/
ADG708CRUZ

ADG708CRUZ

Manufacturer No:

ADG708CRUZ

Manufacturer:

Analog Devices Inc.

Description:

IC MUX 8:1 4.5OHM 16TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

ADG708CRUZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -80dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    10pA (Typ)
  • Channel Capacitance (CS(off), CD(off))
    13pF, 85pF
  • Charge Injection
    3pC
  • -3db Bandwidth
    55MHz
  • Switch Time (Ton, Toff) (Max)
    14ns, 8ns (Typ)
  • Voltage - Supply, Dual (V±)
    ±2.5V
  • Voltage - Supply, Single (V+)
    1.8V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    400mOhm
  • On-State Resistance (Max)
    4.5Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XC7Z030-1FBG676I is a specific model of the Xilinx Zynq-7000 family of integrated circuit chips. These chips combine a dual-core ARM Cortex-A9 processor with programmable logic, making them suitable for a wide range of applications. Here are some advantages and application scenarios of the XC7Z030-1FBG676I:Advantages: 1. High-performance processing: The dual-core ARM Cortex-A9 processor provides high-performance processing capabilities, making it suitable for applications that require significant computational power. 2. Programmable logic: The programmable logic fabric allows for the implementation of custom hardware accelerators, enabling the chip to be tailored to specific application requirements. 3. Low power consumption: The XC7Z030-1FBG676I is designed to be power-efficient, making it suitable for battery-powered or energy-constrained applications. 4. Integrated peripherals: The chip includes a wide range of integrated peripherals such as USB, Ethernet, UART, SPI, I2C, and GPIO, reducing the need for additional external components.Application scenarios: 1. Embedded systems: The XC7Z030-1FBG676I is commonly used in embedded systems where a combination of high-performance processing and programmable logic is required. This includes applications such as industrial automation, robotics, and automotive systems. 2. Software-defined radio (SDR): The chip's programmable logic can be used to implement custom radio frequency (RF) processing blocks, making it suitable for SDR applications that require flexibility and adaptability. 3. Video processing: The high-performance processing capabilities of the chip, combined with its programmable logic, make it suitable for video processing applications such as video surveillance, video analytics, and video encoding/decoding. 4. Internet of Things (IoT): The XC7Z030-1FBG676I can be used in IoT applications that require both processing power and the ability to interface with various sensors and communication protocols. 5. High-performance computing (HPC): The chip's processing capabilities, combined with its programmable logic, can be utilized in HPC applications that require parallel processing and acceleration of specific algorithms.Overall, the XC7Z030-1FBG676I offers a combination of processing power, programmability, and integrated peripherals, making it suitable for a wide range of applications that require high-performance processing and customization.
ADG708CRUZ Relevant information