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ADG509AKRZ-REEL

ADG509AKRZ-REEL

Manufacturer No:

ADG509AKRZ-REEL

Manufacturer:

Analog Devices Inc.

Description:

IC SWITCH SP4T X 2 450OHM 16SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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ADG509AKRZ-REEL Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    1nA
  • Channel Capacitance (CS(off), CD(off))
    5pF, 11pF
  • Charge Injection
    4pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    300ns, 300ns
  • Voltage - Supply, Dual (V±)
    ±10.8V ~ 16.5V
  • Voltage - Supply, Single (V+)
    10.8V ~ 16.5V
  • Channel-to-Channel Matching (ΔRon)
    22.5Ohm
  • On-State Resistance (Max)
    450Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    4:1
  • Switch Circuit
    SP4T
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The XCZU3CG-2SFVC784E is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance processing: The XCZU3CG-2SFVC784E chip combines a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor, along with programmable logic resources. This allows for high-performance processing capabilities, making it suitable for demanding applications.2. Programmable logic: The chip includes programmable logic resources, which can be customized and programmed to implement specific functions or algorithms. This flexibility makes it suitable for a wide range of applications that require hardware acceleration or custom logic implementation.3. Integrated peripherals: The XCZU3CG-2SFVC784E chip includes a wide range of integrated peripherals such as USB, Ethernet, PCIe, and DDR memory controllers. This simplifies the design process and reduces the need for additional external components.4. Low power consumption: The chip is designed to optimize power consumption, making it suitable for applications where power efficiency is important.Application scenarios: 1. Embedded systems: The XCZU3CG-2SFVC784E chip is commonly used in embedded systems that require high-performance processing capabilities along with programmable logic. It can be used in applications such as industrial automation, robotics, and automotive systems.2. Edge computing: With its combination of processing power and programmable logic, the chip is well-suited for edge computing applications. It can perform real-time processing and analytics at the edge of the network, reducing the need for data transmission to the cloud.3. Video processing and analytics: The XCZU3CG-2SFVC784E chip's high-performance processing capabilities make it suitable for video processing and analytics applications. It can be used in video surveillance systems, video analytics platforms, and video encoding/decoding applications.4. High-performance computing: The chip's processing power and programmable logic resources make it suitable for high-performance computing applications. It can be used in areas such as scientific research, data centers, and cloud computing.Overall, the XCZU3CG-2SFVC784E chip offers a combination of processing power, programmable logic, and integrated peripherals, making it suitable for a wide range of applications that require high-performance processing and customization capabilities.
ADG509AKRZ-REEL Relevant information