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ADG786BCPZ

ADG786BCPZ

Manufacturer No:

ADG786BCPZ

Manufacturer:

Analog Devices Inc.

Description:

IC SWITCH SPDTX3 4.5OHM 20LFCSP

Datasheet:

Datasheet

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ADG786BCPZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-LFCSP (4x4)
  • Package / Case
    20-WFQFN Exposed Pad, CSP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -80dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    11pF
  • Charge Injection
    5pC
  • -3db Bandwidth
    160MHz
  • Switch Time (Ton, Toff) (Max)
    21ns, 10ns (Typ)
  • Voltage - Supply, Dual (V±)
    ±2.5V
  • Voltage - Supply, Single (V+)
    1.8V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    4.5Ohm
  • Number of Circuits
    3
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The XCZU3CG-1SFVC784I is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance processing: The XCZU3CG-1SFVC784I chip combines a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor, along with programmable logic resources. This allows for high-performance processing capabilities, making it suitable for demanding applications.2. Programmable logic: The chip includes programmable logic resources, which can be used to implement custom hardware accelerators, interfaces, or other specialized functionality. This flexibility enables the chip to be tailored to specific application requirements.3. Integrated peripherals: The XCZU3CG-1SFVC784I chip includes a wide range of integrated peripherals, such as USB, Ethernet, PCIe, and various serial interfaces. These peripherals simplify system design and reduce the need for additional external components.4. Low power consumption: The chip is designed to optimize power consumption, making it suitable for power-constrained applications. It includes power management features that allow for dynamic power scaling and efficient power usage.Application scenarios: 1. Embedded systems: The XCZU3CG-1SFVC784I chip is commonly used in embedded systems that require a combination of high-performance processing and programmable logic. It can be used in applications such as industrial automation, robotics, and automotive systems.2. Edge computing: With its powerful processing capabilities and programmable logic, the chip is well-suited for edge computing applications. It can perform real-time data processing and analysis at the edge of the network, reducing the need for data transmission to the cloud.3. High-bandwidth data processing: The chip's integrated peripherals, such as PCIe and Ethernet, make it suitable for applications that require high-bandwidth data processing. This includes areas like high-speed networking, data centers, and video processing.4. Software-defined systems: The XCZU3CG-1SFVC784I chip's combination of processing cores and programmable logic allows for the implementation of software-defined systems. It can be used in applications that require dynamic reconfiguration and adaptability, such as software-defined radios or software-defined networking.Overall, the XCZU3CG-1SFVC784I chip offers a balance of processing power, programmability, and integrated peripherals, making it suitable for a wide range of applications that require high-performance and flexibility.
ADG786BCPZ Relevant information