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DG403DY-E3

DG403DY-E3

Manufacturer No:

DG403DY-E3

Manufacturer:

Vishay Siliconix

Description:

IC SW SPST-NO/NCX2 45OHM 16SOIC

Datasheet:

Datasheet

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DG403DY-E3 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -90dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    12pF, 12pF
  • Charge Injection
    60pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    150ns, 100ns
  • Voltage - Supply, Dual (V±)
    ±7V ~ 22V
  • Voltage - Supply, Single (V+)
    13V ~ 36V
  • Channel-to-Channel Matching (ΔRon)
    3Ohm
  • On-State Resistance (Max)
    45Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO/NC
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S100-1FC1152I is an integrated circuit chip developed by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of the M2S100-1FC1152I:Advantages: 1. Versatility: The M2S100-1FC1152I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family, including the M2S100-1FC1152I, offers advanced security features such as secure boot, tamper detection, and secure key storage. These features make it suitable for applications that require robust security measures. 4. Low power consumption: The M2S100-1FC1152I chip is designed to be power-efficient, making it suitable for battery-powered or energy-constrained applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling complex applications and real-time processing.Application scenarios: 1. Industrial automation: The M2S100-1FC1152I chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. Its flexibility allows for customization based on specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller, the chip is suitable for IoT applications that require both hardware acceleration and software programmability. It can be used in IoT gateways, edge computing devices, or sensor nodes. 3. Aerospace and defense: The M2S100-1FC1152I chip's security features make it suitable for aerospace and defense applications that require secure boot, data encryption, or tamper detection. It can be used in avionics systems, secure communication devices, or military-grade equipment. 4. Medical devices: The chip's low power consumption and high performance make it suitable for medical devices such as patient monitoring systems, portable diagnostic devices, or implantable devices. 5. Communications: The M2S100-1FC1152I chip can be used in communication systems for tasks such as protocol conversion, signal processing, or network acceleration.These are just a few examples of the advantages and application scenarios of the M2S100-1FC1152I chip. Its versatility and integration make it suitable for a wide range of applications where both hardware customization and software programmability are required.
DG403DY-E3 Relevant information