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DG408DQ-E3

DG408DQ-E3

Manufacturer No:

DG408DQ-E3

Manufacturer:

Vishay Siliconix

Description:

IC MUX 8:1 100OHM 16TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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DG408DQ-E3 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    3pF, 26pF
  • Charge Injection
    20pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    150ns, 150ns
  • Voltage - Supply, Dual (V±)
    ±5V ~ 20V
  • Voltage - Supply, Single (V+)
    5V ~ 36V
  • Channel-to-Channel Matching (ΔRon)
    15Ohm (Max)
  • On-State Resistance (Max)
    100Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S150TS-1FC1152I is a specific model of integrated circuit (IC) chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S150TS-1FC1152I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 processor core, providing the flexibility of programmable logic and the processing power of an embedded microcontroller. 2. Integration: It integrates various components like FPGA fabric, processor, memory, and peripherals into a single chip, reducing the need for external components and simplifying system design. 3. Security: The chip offers advanced security features, including secure boot, tamper detection, and secure key storage, making it suitable for applications requiring robust security measures. 4. Low power consumption: The SmartFusion2 family is designed to be power-efficient, enabling longer battery life and reducing overall power consumption in applications.Application scenarios: 1. Industrial automation: The M2S150TS-1FC1152I chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and communication protocols. Its FPGA fabric allows customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and ARM Cortex-M3 processor, this chip is suitable for IoT applications that require both hardware flexibility and processing capabilities. It can be used in smart home devices, environmental monitoring systems, or edge computing devices. 3. Aerospace and defense: The M2S150TS-1FC1152I chip's security features make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication devices, or military-grade embedded systems. 4. Medical devices: The chip's integration and low power consumption make it suitable for medical devices like patient monitoring systems, portable diagnostic devices, or implantable devices where power efficiency and compactness are crucial.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project.
DG408DQ-E3 Relevant information