ADG608BRZ-REEL
Manufacturer No:
ADG608BRZ-REEL
Manufacturer:
Description:
IC MUX 8:1 30OHM 16SOIC
Datasheet:
Delivery:
Payment:
In Stock : 6006
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ADG608BRZ-REEL Specifications
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TypeParameter
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Supplier Device Package16-SOIC
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Package / Case16-SOIC (0.154", 3.90mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Crosstalk-85dB @ 100kHz
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Current - Leakage (IS(off)) (Max)500pA
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Channel Capacitance (CS(off), CD(off))9pF, 40pF
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Charge Injection6pC
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-3db Bandwidth-
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Switch Time (Ton, Toff) (Max)75ns, 45ns
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Voltage - Supply, Dual (V±)±5V
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Voltage - Supply, Single (V+)3.3V ~ 5V
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Channel-to-Channel Matching (ΔRon)5Ohm (Max)
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On-State Resistance (Max)30Ohm
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Number of Circuits1
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Multiplexer/Demultiplexer Circuit8:1
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Switch Circuit-
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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Series-
The M2S010S-1VFG400I is an integrated circuit chip from Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S010S-1VFG400I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features like secure boot, tamper detection, and secure key storage. This makes the M2S010S-1VFG400I chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications.Application Scenarios: 1. Industrial Automation: The M2S010S-1VFG400I chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization of I/O interfaces and real-time processing, while the microcontroller subsystem can handle control algorithms and communication protocols. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller, the chip can be used in IoT applications for edge computing, data processing, and connectivity. It can handle sensor data acquisition, protocol conversion, and local analytics, reducing the need for cloud processing and improving response time. 3. Aerospace and Defense: The security features of the SmartFusion2 family make the M2S010S-1VFG400I chip suitable for aerospace and defense applications. It can be used in avionics systems, secure communication devices, and military-grade equipment that require high reliability and security. 4. Medical Devices: The chip's low power consumption and integration make it suitable for medical devices like patient monitoring systems, portable diagnostic tools, and implantable devices. The FPGA fabric can be used for signal processing and customization, while the microcontroller subsystem can handle data acquisition and communication.These are just a few examples of the advantages and application scenarios of the M2S010S-1VFG400I chip. The versatility and integration of this chip make it suitable for a wide range of applications where both hardware customization and software programmability are required.
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