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ADG722BRMZ

ADG722BRMZ

Manufacturer No:

ADG722BRMZ

Manufacturer:

Analog Devices Inc.

Description:

IC SWITCH SPST-NC X 2 4OHM 8MSOP

Datasheet:

Datasheet

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ADG722BRMZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-MSOP
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -97dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    250pA
  • Channel Capacitance (CS(off), CD(off))
    7pF, 7pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    200MHz
  • Switch Time (Ton, Toff) (Max)
    14ns, 6ns (Typ)
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.8V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    300mOhm
  • On-State Resistance (Max)
    4Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NC
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S090T-FCSG325I is an integrated circuit chip developed by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S090T-FCSG325I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features such as secure boot, tamper detection, and secure key storage. This makes the M2S090T-FCSG325I chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications.Application scenarios: 1. Industrial automation: The M2S090T-FCSG325I chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller subsystem, the chip can be used in IoT devices for edge computing, data processing, and connectivity. The security features make it suitable for secure IoT applications. 3. Aerospace and defense: The chip's integration, low power consumption, and security features make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication devices, and military equipment. 4. Medical devices: The M2S090T-FCSG325I chip can be used in medical devices such as patient monitoring systems, diagnostic equipment, and portable medical devices. The low power consumption and integration help in designing compact and energy-efficient devices.These are just a few examples of the advantages and application scenarios of the M2S090T-FCSG325I chip. The versatility and features of this chip make it suitable for a wide range of applications in various industries.
ADG722BRMZ Relevant information