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ADG801BRMZ

ADG801BRMZ

Manufacturer No:

ADG801BRMZ

Manufacturer:

Analog Devices Inc.

Description:

IC SW SPST-NOX1 300MOHM 8MSOP

Datasheet:

Datasheet

Delivery:

Payment:

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ADG801BRMZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-MSOP
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    250pA
  • Channel Capacitance (CS(off), CD(off))
    180pF, 180pF
  • Charge Injection
    50pC
  • -3db Bandwidth
    12MHz
  • Switch Time (Ton, Toff) (Max)
    45ns, 15ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.8V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    300mOhm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XCZU2CG-1UBVA530I is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. These chips combine a high-performance processing system with programmable logic, making them suitable for a wide range of applications. Here are some advantages and application scenarios of the XCZU2CG-1UBVA530I:Advantages: 1. High-performance processing: The XCZU2CG-1UBVA530I chip features a dual-core Arm Cortex-A53 processor, a dual-core Arm Cortex-R5 real-time processor, and an Arm Mali-400 MP2 graphics processing unit. This combination provides high-performance processing capabilities for demanding applications.2. Programmable logic: The chip also includes programmable logic resources, allowing users to implement custom hardware accelerators or interface with external devices. This flexibility enables the chip to be tailored to specific application requirements.3. Integrated peripherals: The XCZU2CG-1UBVA530I chip includes a wide range of integrated peripherals, such as USB, Ethernet, PCIe, and various serial interfaces. These peripherals simplify system integration and reduce the need for additional external components.4. Low power consumption: The chip is designed to optimize power consumption, making it suitable for power-constrained applications. It includes power management features that allow dynamic power scaling based on the workload, further reducing power consumption.Application scenarios: 1. Embedded systems: The XCZU2CG-1UBVA530I chip is commonly used in embedded systems that require high-performance processing and programmable logic capabilities. It can be used in applications such as industrial automation, robotics, and automotive systems.2. Edge computing: With its powerful processing capabilities, the chip is suitable for edge computing applications where real-time processing and low latency are critical. It can be used in scenarios such as video analytics, machine vision, and real-time control systems.3. High-performance computing: The XCZU2CG-1UBVA530I chip can be used in high-performance computing applications that require both processing power and programmable logic resources. It can accelerate computationally intensive tasks and enable the implementation of custom algorithms.4. Communication systems: The chip's integrated peripherals and programmable logic make it suitable for communication systems that require high-speed data processing and interface capabilities. It can be used in applications such as software-defined radios, network switches, and baseband processing.Overall, the XCZU2CG-1UBVA530I chip offers a combination of high-performance processing, programmable logic, and integrated peripherals, making it versatile for a wide range of applications in various industries.
ADG801BRMZ Relevant information