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DG411DJZ

DG411DJZ

Manufacturer No:

DG411DJZ

Description:

IC SWITCH SPST-NCX4 35OHM 16DIP

Datasheet:

Datasheet

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DG411DJZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-PDIP
  • Package / Case
    16-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -85dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    9pF, 9pF
  • Charge Injection
    5pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    175ns, 145ns
  • Voltage - Supply, Dual (V±)
    ±5V ~ 20V
  • Voltage - Supply, Single (V+)
    5V ~ 44V
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    35Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NC
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S090-1FCS325I is an integrated circuit chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S090-1FCS325I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family of chips, including the M2S090-1FCS325I, offers advanced security features such as secure boot, tamper detection, and secure key storage. These features make it suitable for applications that require high levels of security. 4. Low power consumption: The M2S090-1FCS325I chip is designed to be power-efficient, making it suitable for battery-powered or energy-constrained applications.Application scenarios: 1. Industrial automation: The M2S090-1FCS325I chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. Its FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller subsystem, the chip can be used in IoT devices for edge computing, data processing, and connectivity. Its security features also make it suitable for secure IoT applications. 3. Aerospace and defense: The M2S090-1FCS325I chip's ruggedness, low power consumption, and security features make it suitable for aerospace and defense applications. It can be used in avionics systems, military communication devices, and secure data processing. 4. Medical devices: The chip's versatility and security features make it suitable for medical devices such as patient monitoring systems, medical imaging equipment, and portable diagnostic devices. 5. Automotive: The M2S090-1FCS325I chip can be used in automotive applications for tasks such as advanced driver assistance systems (ADAS), infotainment systems, and vehicle networking.These are just a few examples of the advantages and application scenarios of the M2S090-1FCS325I chip. The versatility and integration of this chip make it suitable for a wide range of applications where both hardware customization and software programmability are required.
DG411DJZ Relevant information