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DG419BDY-T1-E3

DG419BDY-T1-E3

Manufacturer No:

DG419BDY-T1-E3

Manufacturer:

Vishay Siliconix

Description:

IC SWITCH SPDT X 1 25OHM 8SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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DG419BDY-T1-E3 Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -88dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    250pA
  • Channel Capacitance (CS(off), CD(off))
    12pF, 12pF
  • Charge Injection
    38pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    89ns, 80ns
  • Voltage - Supply, Dual (V±)
    ±7V ~ 22V
  • Voltage - Supply, Single (V+)
    13V ~ 36V
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    25Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The XCZU2CG-2SFVC784E is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance processing: The XCZU2CG-2SFVC784E chip combines a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor, along with programmable logic resources. This allows for high-performance processing capabilities, making it suitable for demanding applications.2. Programmable logic: The chip includes programmable logic resources, which can be used to implement custom hardware accelerators, interfaces, or other specialized functionality. This flexibility enables the chip to be tailored to specific application requirements.3. Integrated peripherals: The XCZU2CG-2SFVC784E chip integrates various peripherals, such as USB, Ethernet, PCIe, and DDR memory controllers. This integration simplifies system design and reduces the need for additional external components.4. Low power consumption: The chip is designed to optimize power consumption, making it suitable for power-constrained applications. It includes power management features that allow for dynamic power scaling and efficient power usage.Application scenarios: 1. Embedded systems: The XCZU2CG-2SFVC784E chip is commonly used in embedded systems that require a combination of high-performance processing and programmable logic capabilities. It can be used in applications such as industrial automation, robotics, and automotive systems.2. Edge computing: With its processing power and programmable logic resources, the chip is well-suited for edge computing applications. It can perform real-time processing and implement custom algorithms or hardware accelerators, making it useful in scenarios like video analytics, machine learning, and IoT gateways.3. Communications and networking: The integrated peripherals and processing capabilities of the chip make it suitable for communication and networking applications. It can be used in routers, switches, and other network equipment to handle data processing, protocol handling, and traffic management tasks.4. Aerospace and defense: The XCZU2CG-2SFVC784E chip's high-performance processing and programmable logic resources make it suitable for aerospace and defense applications. It can be used in areas such as radar systems, avionics, and secure communications.Overall, the XCZU2CG-2SFVC784E chip offers a combination of processing power, programmable logic, and integrated peripherals, making it versatile for a wide range of applications requiring high-performance and flexibility.
DG419BDY-T1-E3 Relevant information