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DG309BDY-T1-E3

DG309BDY-T1-E3

Manufacturer No:

DG309BDY-T1-E3

Manufacturer:

Vishay Siliconix

Description:

IC SWITCH SPST-NCX4 85OHM 16SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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DG309BDY-T1-E3 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -95dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    5pF, 5pF
  • Charge Injection
    1pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    200ns, 150ns
  • Voltage - Supply, Dual (V±)
    ±4V ~ 22V
  • Voltage - Supply, Single (V+)
    4V ~ 44V
  • Channel-to-Channel Matching (ΔRon)
    1.7Ohm
  • On-State Resistance (Max)
    85Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NC
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The M2S060TS-FG676 integrated circuit chip is a member of the SmartFusion2 family of system-on-chip (SoC) devices developed by Microsemi Corporation. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S060TS-FG676 chip combines an FPGA fabric with a hard ARM Cortex-M3 processor, offering the flexibility of programmable logic and the processing power of a microcontroller in a single device. 2. Integration: The chip integrates various peripherals, including UART, SPI, I2C, GPIO, timers, and memory controllers, reducing the need for external components and simplifying system design. 3. Security: SmartFusion2 devices incorporate security features such as secure boot, tamper detection, and bitstream encryption, making them suitable for applications requiring robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High reliability: SmartFusion2 devices are built with reliability features like single-event upset (SEU) mitigation, making them suitable for applications in harsh environments or aerospace and defense sectors.Application scenarios: 1. Industrial automation: The M2S060TS-FG676 chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols implementation. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller capabilities, the chip can be used in IoT devices for edge computing, data processing, and connectivity. 3. Automotive: The chip can be utilized in automotive applications for functions like advanced driver-assistance systems (ADAS), infotainment systems, and vehicle networking. 4. Aerospace and defense: The reliability and security features of the chip make it suitable for aerospace and defense applications, including avionics, secure communication systems, and military-grade equipment. 5. Medical devices: The chip can be used in medical devices for tasks such as signal processing, data acquisition, and control systems.These are just a few examples of the advantages and application scenarios of the M2S060TS-FG676 integrated circuit chip. The versatility and integration of this chip make it suitable for a wide range of applications across various industries.
DG309BDY-T1-E3 Relevant information