TMUX1072RUTR

TMUX1072RUTR

Manufacturer No:

TMUX1072RUTR

Manufacturer:

Texas Instruments

Description:

IC SWITCH SPDT X 2 18OHM 12UQFN

Datasheet:

Datasheet

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TMUX1072RUTR Specifications

  • Type
    Parameter
  • Supplier Device Package
    12-UQFN (1.7x2)
  • Package / Case
    12-UFQFN
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Crosstalk
    -90dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    185µA
  • Channel Capacitance (CS(off), CD(off))
    4pF, 4pF
  • Charge Injection
    -
  • -3db Bandwidth
    1.2GHz
  • Switch Time (Ton, Toff) (Max)
    250µs, 10µs
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    2.3V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    70mOhm
  • On-State Resistance (Max)
    18Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The M2S090TS-1FCSG325 is an integrated circuit chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S090TS-1FCSG325 chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features such as secure boot, tamper detection, and secure key storage. This makes the M2S090TS-1FCSG325 chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications.Application scenarios: 1. Industrial automation: The M2S090TS-1FCSG325 chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller, the chip can be used in IoT devices for edge computing, data processing, and connectivity. Its security features also make it suitable for secure IoT applications. 3. Aerospace and defense: The M2S090TS-1FCSG325 chip's robustness, security features, and low power consumption make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication devices, and military equipment. 4. Medical devices: The chip's versatility and integration make it suitable for medical devices such as patient monitoring systems, diagnostic equipment, and medical imaging devices. Its low power consumption is beneficial for battery-powered medical devices.These are just a few examples of the advantages and application scenarios of the M2S090TS-1FCSG325 chip. The actual usage depends on the specific requirements and design considerations of the target application.