TS5A3357QDCURQ1
Manufacturer No:
TS5A3357QDCURQ1
Manufacturer:
Description:
IC SWITCH SP3T X 1 15OHM 8VSSOP
Datasheet:
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In Stock : 6256
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TS5A3357QDCURQ1 Specifications
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TypeParameter
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Supplier Device Package8-VSSOP
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Package / Case8-VFSOP (0.091", 2.30mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 125°C (TA)
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Crosstalk-62dB @ 10MHz
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Current - Leakage (IS(off)) (Max)200nA
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Channel Capacitance (CS(off), CD(off))4.5pF, 10.5pF
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Charge Injection3.4pC
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-3db Bandwidth334MHz
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Switch Time (Ton, Toff) (Max)10ns, 6.5ns
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Voltage - Supply, Dual (V±)-
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Voltage - Supply, Single (V+)1.65V ~ 5.5V
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Channel-to-Channel Matching (ΔRon)100mOhm
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On-State Resistance (Max)15Ohm
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Number of Circuits1
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Multiplexer/Demultiplexer Circuit3:1
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Switch CircuitSP3T
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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SeriesAutomotive, AEC-Q100
The M2S090-1FGG676 integrated circuit (IC) chip is a member of the SmartFusion2 family of system-on-chip (SoC) devices developed by Microsemi Corporation. This chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. Here are some advantages and application scenarios for the M2S090-1FGG676 IC:1. Reconfigurable hardware: The FPGA fabric allows for user-defined hardware accelerators and peripherals, providing the flexibility to tailor the chip to specific application requirements. This reconfigurability can be advantageous in scenarios where customization, hardware acceleration, or real-time processing capabilities are desired.2. Embedded microcontroller: The ARM Cortex-M3 microcontroller subsystem offers a high-performance, low-power embedded processing solution. It can be used for tasks such as system control, data processing, communication protocols, or human-machine interface (HMI). Combining the FPGA with a microcontroller subsystem enables a mix of hardware and software processing for optimal system performance.3. Security features: The SmartFusion2 family includes comprehensive security features, including secure boot, flash protection, tamper detection, and secure key storage. These features make the M2S090-1FGG676 chip suitable for applications that require secure data processing, protection against unauthorized access, or tamper resistance.4. Industrial automation: The M2S090-1FGG676 chip's combination of reconfigurable hardware and embedded processing makes it well-suited for various industrial automation applications. It can be used for motor control, process monitoring, machine vision, robotics, and industrial communication protocols like PROFINET or EtherCAT.5. Aerospace and defense: The M2S090-1FGG676 IC's security features and real-time processing capabilities make it suitable for aerospace and defense applications. It can be used in flight control systems, avionics, data recorders, communication equipment, and secure embedded systems for defense purposes.6. IoT and edge computing: The chip's flexible hardware fabric and embedded microcontroller support IoT (Internet of Things) and edge computing applications. It can be used for IoT gateways, sensor data acquisition, data preprocessing, edge AI inference, or machine learning at the edge.7. Medical devices: The M2S090-1FGG676 IC's combination of hardware reconfigurability and embedded microcontroller makes it applicable to medical devices. It can be used in imaging systems, patient monitoring equipment, diagnostic devices, or embedded medical applications that require high computational capabilities.These are just a few examples of the advantages and application scenarios for the M2S090-1FGG676 IC chip. Its versatility, reconfigurability, embedded processing capabilities, and security features make it useful in a wide range of industries and applications where a combination of hardware and software processing is desired.
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