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TS5A3359DCUR

TS5A3359DCUR

Manufacturer No:

TS5A3359DCUR

Manufacturer:

Texas Instruments

Description:

IC SWITCH SP3TX1 900MOHM 8VSSOP

Datasheet:

Datasheet

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TS5A3359DCUR Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-VSSOP
  • Package / Case
    8-VFSOP (0.091", 2.30mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -64dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    20nA
  • Channel Capacitance (CS(off), CD(off))
    18pF, 54pF
  • Charge Injection
    20pC
  • -3db Bandwidth
    75MHz
  • Switch Time (Ton, Toff) (Max)
    21ns, 10.5ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.65V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    100mOhm
  • On-State Resistance (Max)
    900mOhm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    3:1
  • Switch Circuit
    SP3T
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The M2S090-1FG676I is an integrated circuit chip from Microsemi, which is a low-power, high-performance FPGA (Field-Programmable Gate Array). Here are some advantages and application scenarios of this chip:Advantages: 1. Low Power Consumption: The M2S090-1FG676I chip is designed to consume minimal power, making it suitable for battery-powered devices or applications where power efficiency is crucial. 2. High Performance: It offers high-speed processing capabilities, enabling it to handle complex tasks and data-intensive applications. 3. Flexibility: Being an FPGA, the chip can be reprogrammed or reconfigured to perform different functions, allowing for flexibility in design and adaptability to changing requirements. 4. Integration: The chip integrates various components, such as logic gates, memory blocks, and I/O interfaces, reducing the need for external components and simplifying the overall system design. 5. Reliability: Microsemi is known for its reliable and robust FPGA solutions, ensuring the M2S090-1FG676I chip's stability and durability.Application Scenarios: 1. Internet of Things (IoT): The low power consumption and flexibility of the M2S090-1FG676I chip make it suitable for IoT devices, where energy efficiency and adaptability are essential. 2. Industrial Automation: The chip's high performance and integration capabilities make it suitable for industrial automation applications, such as control systems, robotics, and machine vision. 3. Communications: The M2S090-1FG676I chip can be used in communication systems, including wireless base stations, network switches, and routers, where high-speed processing and low power consumption are critical. 4. Automotive: With its reliability and flexibility, the chip can be utilized in automotive applications, such as advanced driver-assistance systems (ADAS), infotainment systems, and engine control units (ECUs). 5. Medical Devices: The M2S090-1FG676I chip's low power consumption and high performance make it suitable for medical devices, including patient monitoring systems, portable diagnostic equipment, and medical imaging devices.These are just a few examples of the advantages and application scenarios of the M2S090-1FG676I integrated circuit chip. Its versatility and capabilities make it suitable for various industries and applications requiring high performance, low power consumption, and flexibility.
TS5A3359DCUR Relevant information