TS5A3357DCUR
Manufacturer No:
TS5A3357DCUR
Manufacturer:
Description:
IC SWITCH SP3T X 1 15OHM 8VSSOP
Datasheet:
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Payment:
In Stock : 8751
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TS5A3357DCUR Specifications
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TypeParameter
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Supplier Device Package8-VSSOP
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Package / Case8-VFSOP (0.091", 2.30mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Crosstalk-62dB @ 10MHz
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Current - Leakage (IS(off)) (Max)100nA
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Channel Capacitance (CS(off), CD(off))4.5pF, 10.5pF
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Charge Injection3.4pC
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-3db Bandwidth334MHz
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Switch Time (Ton, Toff) (Max)6.5ns, 3.7ns
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Voltage - Supply, Dual (V±)-
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Voltage - Supply, Single (V+)1.65V ~ 5.5V
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Channel-to-Channel Matching (ΔRon)100mOhm
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On-State Resistance (Max)15Ohm
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Number of Circuits1
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Multiplexer/Demultiplexer Circuit3:1
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Switch CircuitSP3T
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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Series-
The M2S090-1FGG484 integrated circuit chip is a member of the SmartFusion2 family of system-on-chip (SoC) devices developed by Microsemi Corporation. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S090-1FGG484 chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features such as secure boot, tamper detection, and secure key storage. This makes the M2S090-1FGG484 chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling the chip to handle complex tasks and applications.Application scenarios: 1. Industrial automation: The M2S090-1FGG484 chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller, the chip can be used in IoT devices for edge computing, data processing, and connectivity. The security features make it suitable for secure IoT applications. 3. Aerospace and defense: The chip's security features, low power consumption, and high performance make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication systems, and military-grade equipment. 4. Medical devices: The chip's versatility and integration make it suitable for medical devices such as patient monitoring systems, medical imaging equipment, and diagnostic devices. The low power consumption is beneficial for battery-powered medical devices. 5. Communications: The chip can be used in communication systems for tasks such as signal processing, encryption, and protocol handling. The FPGA fabric allows for customization and adaptation to specific communication standards.These are just a few examples of the advantages and application scenarios of the M2S090-1FGG484 integrated circuit chip. The versatility and integration of this chip make it suitable for a wide range of applications across various industries.
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