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BU4S66G2-TR

BU4S66G2-TR

Manufacturer No:

BU4S66G2-TR

Manufacturer:

Description:

IC SWITCH SPST-NOX1 280OHM 5SSOP

Datasheet:

Datasheet

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BU4S66G2-TR Specifications

  • Type
    Parameter
  • Supplier Device Package
    5-SSOP
  • Package / Case
    SC-74A, SOT-753
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    300nA
  • Channel Capacitance (CS(off), CD(off))
    10pF
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    -
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    3V ~ 18V
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    280Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The OMAP3503ECBC integrated circuit chips, developed by Texas Instruments, have several advantages and application scenarios. Some of them include:1. High Performance: The OMAP3503ECBC chips are based on the ARM Cortex-A8 processor, which offers high processing power and performance. This makes them suitable for applications that require intensive computing tasks, such as multimedia processing, gaming, and industrial automation.2. Low Power Consumption: These chips are designed to be power-efficient, making them ideal for battery-powered devices like smartphones, tablets, and portable media players. The low power consumption helps in extending the battery life of these devices.3. Multimedia Capabilities: OMAP3503ECBC chips come with integrated multimedia accelerators, including a dedicated graphics engine and video processing unit. This enables them to handle high-definition video playback, 3D graphics rendering, and image processing tasks efficiently. Hence, they are commonly used in multimedia devices and applications.4. Connectivity Options: These chips offer various connectivity options, including USB, Ethernet, and multiple serial interfaces. This makes them suitable for applications that require connectivity with external devices, such as IoT devices, embedded systems, and communication devices.5. Industrial Applications: OMAP3503ECBC chips are widely used in industrial applications, such as factory automation, robotics, and control systems. Their high performance, low power consumption, and connectivity options make them suitable for demanding industrial environments.6. Automotive Applications: These chips find applications in automotive systems, including infotainment systems, navigation systems, and driver assistance systems. Their multimedia capabilities, connectivity options, and robustness make them suitable for automotive environments.7. Medical Devices: OMAP3503ECBC chips are used in medical devices like portable ultrasound machines, patient monitoring systems, and medical imaging devices. Their high performance and low power consumption are crucial for these battery-powered devices.Overall, OMAP3503ECBC integrated circuit chips offer a combination of high performance, low power consumption, multimedia capabilities, and connectivity options, making them suitable for a wide range of applications in consumer electronics, industrial automation, automotive, and medical fields.
BU4S66G2-TR Relevant information