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M74HCT4051ADTR2G

M74HCT4051ADTR2G

Manufacturer No:

M74HCT4051ADTR2G

Manufacturer:

onsemi

Description:

IC MUX 8:1 100OHM 16TSSOP

Datasheet:

Datasheet

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Payment:

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M74HCT4051ADTR2G Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C (TA)
  • Crosstalk
    -60dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    200nA
  • Channel Capacitance (CS(off), CD(off))
    130pF
  • Charge Injection
    -
  • -3db Bandwidth
    80MHz
  • Switch Time (Ton, Toff) (Max)
    -
  • Voltage - Supply, Dual (V±)
    ±2V ~ 6V
  • Voltage - Supply, Single (V+)
    2V ~ 6V
  • Channel-to-Channel Matching (ΔRon)
    10Ohm
  • On-State Resistance (Max)
    100Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The 96MPAR-2.3G-4MFST integrated circuit chips have several advantages and application scenarios:1. High performance: The 96MPAR-2.3G-4MFST chips offer a processing power of 96 million instructions per second (MIPS), making them ideal for demanding applications that require significant computational capabilities.2. Advanced connectivity: These chips include built-in wireless connectivity options such as Wi-Fi and Bluetooth, allowing seamless integration into various wireless communication systems.3. Low power consumption: The integration of power-saving features in these chips ensures efficient power usage, making them suitable for battery-operated devices or applications where power efficiency is crucial.4. Multi-functionality: The 96MPAR-2.3G-4MFST chips are designed to handle multiple functions within a single chip. They can perform complex tasks such as data processing, encryption, communication, and sensor integration, enabling them to be used in a wide range of applications.5. Application-specific features: These chips may offer specialized features tailored to specific application scenarios. For example, they might include image processing capabilities, encryption algorithms, or real-time signal processing functionalities.Potential application scenarios for 96MPAR-2.3G-4MFST chips include:1. Smart home automation: The chips can be used in smart home systems to connect and control various devices, handle data processing tasks, and communicate with other smart devices or cloud platforms.2. Internet of Things (IoT) devices: These chips can be integrated into IoT devices to enable connectivity, data processing, and communication with other devices or cloud services, facilitating efficient and reliable IoT network operation.3. Industrial automation: The high computational power of the chips makes them suitable for industrial automation applications, where they can control and monitor complex processes, interface with sensors and actuators, and perform real-time data processing.4. Wearable technology: The low power consumption and advanced connectivity options of the chips make them ideal for wearable devices such as smartwatches or fitness trackers, enabling efficient data collection, processing, and wireless communication functionalities.5. Edge computing: The chips can be used in edge computing applications, where computation and data processing are performed closer to the data source, reducing latency and improving overall system performance.These advantages and application scenarios highlight the versatility and potential of 96MPAR-2.3G-4MFST integrated circuit chips in various domains ranging from consumer electronics to industrial applications.
M74HCT4051ADTR2G Relevant information