74LVC2G66DC,125
Manufacturer No:
74LVC2G66DC,125
Manufacturer:
Description:
IC SWITCH SPST-NOX2 10OHM 8VSSOP
Datasheet:
Delivery:
Payment:
In Stock : 147311
Please send RFQ , we will respond immediately.
74LVC2G66DC,125 Specifications
-
TypeParameter
-
Supplier Device Package8-VSSOP
-
Package / Case8-VFSOP (0.091", 2.30mm Width)
-
Mounting TypeSurface Mount
-
Operating Temperature-40°C ~ 125°C (TA)
-
Crosstalk-56dB @ 1MHz
-
Current - Leakage (IS(off)) (Max)5µA
-
Channel Capacitance (CS(off), CD(off))5pF
-
Charge Injection7.5pC
-
-3db Bandwidth500MHz
-
Switch Time (Ton, Toff) (Max)3.9ns, 5ns
-
Voltage - Supply, Dual (V±)-
-
Voltage - Supply, Single (V+)1.65V ~ 5.5V
-
Channel-to-Channel Matching (ΔRon)-
-
On-State Resistance (Max)10Ohm
-
Number of Circuits2
-
Multiplexer/Demultiplexer Circuit1:1
-
Switch CircuitSPST - NO
-
PackagingCut Tape (CT)
-
PackagingTape & Reel (TR)
-
Product StatusActive
-
Series74LVC
The EP900DM/B integrated circuit chips offer several advantages and can be applied to various scenarios:1. Low power consumption: EP900DM/B chips are designed with low power requirements, making them ideal for energy-efficient devices and battery-powered applications. This advantage makes them suitable for use in portable devices like smartphones, wearables, and IoT devices.2. High performance: Despite their low power consumption, EP900DM/B chips provide high performance capabilities. They offer fast processing speeds and efficient data management, making them suitable for tasks that require real-time processing or heavy computational needs.3. Connectivity options: These chips come with integrated wireless connectivity options such as Wi-Fi, Bluetooth, and NFC. This allows them to easily connect and communicate with other devices, enabling scenarios like IoT applications, smart home automation, and remote monitoring systems.4. Security features: EP900DM/B chips come with built-in security features like encryption and secure boot capabilities. This makes them suitable for applications that require data security, such as payment systems, biometric authentication, and secure communication channels.5. Cost-effective: The EP900DM/B chips offer a cost-effective solution due to their low power consumption and high integration capabilities. This makes them attractive for manufacturers looking to develop affordable devices without compromising on performance and functionality.6. Industrial applications: The EP900DM/B chips are suitable for various industrial applications, including robotics, automation systems, and industrial monitoring. With their high computing power and connectivity options, they can effectively handle complex tasks and provide real-time data analysis.In summary, the EP900DM/B integrated circuit chips offer advantages such as low power consumption, high performance, connectivity options, security features, cost-effectiveness, and suitability for industrial applications. Their broad range of capabilities makes them suitable for use in a variety of scenarios across multiple industries.
74LVC2G66DC,125 Relevant information
-
DG509AAZ/883B
Analog Devices Inc./Maxim Integrated -
TS12A4514PE4
Analog Devices Inc. -
TS3A24159DGSR
Analog Devices Inc. -
TS12A4515DBVR
Analog Devices Inc. -
SW202NBC
NXP Semiconductors -
MAX464CNI
NXP Semiconductors -
MC74HC4051ADWR2G
NXP Semiconductors -
74LVC1G3157GWXL
Nexperia USA Inc. -
SW202NBC
NXP Semiconductors -
TDA3683J/N2S,112
Analog Devices Inc.