XS3A1T3157GMX

XS3A1T3157GMX

Manufacturer No:

XS3A1T3157GMX

Manufacturer:

Nexperia USA Inc.

Description:

IC SWITCH SPDT X 1 900MOHM 6XSON

Datasheet:

Datasheet

Delivery:

Payment:

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XS3A1T3157GMX Specifications

  • Type
    Parameter
  • Supplier Device Package
    6-XSON, SOT886 (1.45x1)
  • Package / Case
    6-XFDFN
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -90dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    10nA
  • Channel Capacitance (CS(off), CD(off))
    35pF
  • Charge Injection
    15pC
  • -3db Bandwidth
    40MHz
  • Switch Time (Ton, Toff) (Max)
    40ns, 20ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.4V ~ 4.3V
  • Channel-to-Channel Matching (ΔRon)
    100mOhm
  • On-State Resistance (Max)
    900mOhm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The PAL16H2ML883B is a specific type of integrated circuit chip that belongs to the PAL (Programmable Array Logic) family. It offers several advantages and can be used in various application scenarios. Here are some of the advantages and application scenarios of the PAL16H2ML883B:Advantages: 1. Programmability: The PAL16H2ML883B is a programmable logic device, allowing users to configure its internal logic functions according to their specific requirements. This flexibility makes it suitable for a wide range of applications. 2. High density: This chip offers a high level of logic density, meaning it can accommodate a large number of logic gates and functions in a compact package. This makes it suitable for applications where space is limited. 3. Low power consumption: The PAL16H2ML883B is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial. 4. High reliability: The "ML883B" in the part number indicates that this chip is manufactured to meet military-grade specifications, ensuring high reliability and performance in harsh environments.Application Scenarios: 1. Digital circuit design: The PAL16H2ML883B can be used in various digital circuit designs, such as in microcontrollers, embedded systems, or digital signal processing applications. Its programmability allows designers to implement custom logic functions. 2. Aerospace and defense: The military-grade specifications of the PAL16H2ML883B make it suitable for aerospace and defense applications, where reliability and performance in extreme conditions are critical. 3. Industrial automation: The chip can be used in industrial automation systems, such as programmable logic controllers (PLCs), where it can provide custom logic functions for controlling and monitoring industrial processes. 4. Communication systems: The PAL16H2ML883B can be used in communication systems, such as routers or switches, to implement specific logic functions required for data routing, packet filtering, or protocol handling.It's important to note that the specific application scenarios may vary depending on the requirements and design choices of the user.