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74LVC1G3157GW,125

74LVC1G3157GW,125

Manufacturer No:

74LVC1G3157GW,125

Manufacturer:

Nexperia USA Inc.

Description:

IC SWITCH SPDT X 1 10OHM 6TSSOP

Datasheet:

Datasheet

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74LVC1G3157GW,125 Specifications

  • Type
    Parameter
  • Supplier Device Package
    6-TSSOP
  • Package / Case
    6-TSSOP, SC-88, SOT-363
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    5µA
  • Channel Capacitance (CS(off), CD(off))
    6pF
  • Charge Injection
    7.5pC
  • -3db Bandwidth
    300MHz
  • Switch Time (Ton, Toff) (Max)
    4ns, 3.5ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.65V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    10Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74LVC
The PAL16R8BML/883B is a programmable array logic (PAL) integrated circuit chip. Here are some advantages and application scenarios of this chip:Advantages: 1. Programmability: The PAL16R8BML/883B chip can be programmed to implement various logic functions, making it highly versatile and adaptable to different applications. 2. Compact Size: This chip is available in a small package, allowing for space-efficient designs. 3. Low Power Consumption: The PAL16R8BML/883B chip is designed to operate with low power consumption, making it suitable for battery-powered devices. 4. High Reliability: The "883B" suffix indicates that this chip is manufactured to meet military-grade specifications, ensuring high reliability and durability.Application Scenarios: 1. Digital Logic Design: The PAL16R8BML/883B chip can be used to implement various digital logic functions, such as combinational logic circuits, sequential logic circuits, and arithmetic circuits. 2. Control Systems: It can be used in control systems to perform tasks like signal conditioning, data manipulation, and decision-making. 3. Communication Systems: This chip can be utilized in communication systems for tasks like data encoding, decoding, multiplexing, and demultiplexing. 4. Embedded Systems: The PAL16R8BML/883B chip can be integrated into embedded systems to provide custom logic functions, enabling specific functionalities and enhancing system performance. 5. Test Equipment: It can be used in test equipment to generate test patterns, perform signal analysis, and control test sequences.Overall, the PAL16R8BML/883B chip's programmability, compact size, low power consumption, and high reliability make it suitable for a wide range of applications in digital logic design, control systems, communication systems, embedded systems, and test equipment.
74LVC1G3157GW,125 Relevant information