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DG303ACJ+

DG303ACJ+

Manufacturer No:

DG303ACJ+

Description:

IC SWITCH SPDT X 2 50OHM 14DIP

Datasheet:

Datasheet

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DG303ACJ+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-PDIP
  • Package / Case
    14-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -74dB @ 500kHz
  • Current - Leakage (IS(off)) (Max)
    5nA
  • Channel Capacitance (CS(off), CD(off))
    14pF, 14pF
  • Charge Injection
    12pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    300ns, 250ns
  • Voltage - Supply, Dual (V±)
    ±5V ~ 18V
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    50Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The LX2160XE71826B is a specific model of integrated circuit (IC) chip developed by NXP Semiconductors. It belongs to the Layerscape family of multicore processors and is designed for high-performance networking and data center applications. Here are some advantages and application scenarios of the LX2160XE71826B IC chips:Advantages: 1. High Performance: The LX2160XE71826B features 16 ARM Cortex-A72 cores, each capable of running at up to 2.2 GHz. This provides significant processing power for demanding applications. 2. Networking Capabilities: The chip includes integrated Ethernet interfaces, supporting up to 100 Gigabit Ethernet speeds. It also supports various networking protocols, making it suitable for networking equipment and applications. 3. Scalability: The Layerscape family of processors, including the LX2160XE71826B, is designed to be scalable. This means that it can be used in a range of applications, from small-scale systems to large-scale data centers. 4. Power Efficiency: The chip is designed to be power-efficient, helping to reduce energy consumption and heat generation in systems where it is used.Application Scenarios: 1. Networking Equipment: The LX2160XE71826B is commonly used in networking equipment such as routers, switches, and gateways. Its high-performance cores and networking capabilities make it suitable for handling large amounts of network traffic. 2. Data Centers: With its high processing power and networking capabilities, the chip is well-suited for data center applications. It can be used in servers, storage systems, and other infrastructure components to handle compute-intensive tasks and network traffic. 3. Edge Computing: The chip's power efficiency and scalability make it suitable for edge computing applications. It can be used in edge servers or gateways to process data locally, reducing latency and improving overall system performance. 4. Network Function Virtualization (NFV): The LX2160XE71826B can be used in NFV deployments, where network functions are virtualized and run on standard hardware. Its high-performance cores and networking capabilities enable efficient execution of virtualized network functions.Overall, the LX2160XE71826B IC chips offer high performance, networking capabilities, scalability, and power efficiency, making them suitable for a range of networking, data center, edge computing, and NFV applications.
DG303ACJ+ Relevant information